AMAT Applied Materials 0010-26057晶圓升降組件
1.產(chǎn) 品 資 料 介 紹:
- 設(shè)備適配:匹配 AMAT CVD/PVD/ 蝕刻機(jī)臺(tái)(如 Producer、Endura 系列),可接入原有自動(dòng)化系統(tǒng),無(wú)需改協(xié)議。
- 晶圓兼容:主打 300mm 晶圓,換氧化鋁陶瓷托盤(Ra≤0.2μm)可兼容 200mm,防劃傷薄膜。
- 核心功能:負(fù)責(zé)晶圓在腔室間升降轉(zhuǎn)運(yùn),確保與腔室部件同軸度誤差≤0.1mm,保障工藝均勻性。
- 定位精度:亞微米級(jí)閉環(huán)控制,光柵尺(0.1μm)+ 伺服電機(jī)(0.8N?m),誤差 ±0.5μm,適配 3x 納米制程。
- 運(yùn)行穩(wěn)定:諧波減速器(≤1 弧分)消間隙,升降速度 0.5-5mm/s 可調(diào),接近部件時(shí)自動(dòng)低速(0.5mm/s)。
- 環(huán)境適應(yīng):真空兼容(漏率≤1×10?? Pa?m3/s,1×10?3 - 1×10?? Pa 可用),Y?O?涂層抗等離子腐蝕,壽命超 10000 小時(shí)。
- 模塊化:分驅(qū)動(dòng) / 承載 / 檢測(cè)單元,標(biāo)準(zhǔn)化接口,單獨(dú)更換≤30 分鐘,降停機(jī)成本。
- 晶圓防護(hù):三點(diǎn)柔性支撐(接觸 0.5mm2)減污染,聚氨酯緩沖(50 Shore A,行程 2mm)防碎裂。
- 清潔適配:無(wú)死角結(jié)構(gòu) + 鈍化處理(耐蝕≥9 級(jí)),兼容 IPA、氨水清潔,支持在線維護(hù)。
AMAT Applied Materials 0010-26057晶圓升降組件 英文資料:
1. Adaptation scenarios and functions (0010-26057)
Equipment adaptation: Matching AMAT CVD/PVD/etching machines (such as Producer, Endura series), can be integrated into existing automation systems without changing protocols.
Wafer compatibility: Mainly designed for 300mm wafers, compatible with 200mm and scratch resistant film on aluminum oxide ceramic trays (Ra ≤ 0.2 μ m).
Core function: Responsible for lifting and transporting wafers between chambers, ensuring coaxiality error with chamber components is ≤ 0.1mm, and ensuring process uniformity.
2. Accuracy and Performance (0010-26057)
Positioning accuracy: sub micron level closed-loop control, grating ruler (0.1 μ m)+servo motor (0.8N · m), error ± 0.5 μ m, suitable for 3x nanometer process.
Stable operation: Harmonic reducer (≤ 1 arc minute) eliminates clearance, adjustable lifting speed of 0.5-5mm/s, and automatically slows down (0.5mm/s) when approaching components.
Environmental adaptation: Vacuum compatible (leakage rate ≤ 1 × 10 ?? Pa · m 3/s, 1 × 10 ?3 -1 × 10 ?? Pa available), Y ? O3 coating resistant to plasma corrosion, with a lifespan of over 10000 hours.
3. Structure and Protection (0010-26057)
Modularization: divided into drive/load/detection units, standardized interfaces, individual replacement ≤ 30 minutes, reducing downtime costs.
Wafer protection: Three point flexible support (contact 0.5mm 2) reduces pollution, polyurethane buffer (50 Shore A, stroke 2mm) prevents breakage.
Cleaning adaptation: no dead corner structure+passivation treatment (corrosion resistance ≥ 9 levels), compatible with IPA and ammonia cleaning, supports online maintenance.
AMAT Applied Materials 0010-26057晶圓升降組件 產(chǎn)品展示

產(chǎn)品視頻
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
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