MKS AX7695遠程等離子源
1.產(chǎn) 品 資 料 介 紹:
中文資料:
MKS AX7695 是 MKS Instruments 生產(chǎn)的一款遠程等離子源,主要用于半導(dǎo)體制造過程中提供反應(yīng)性氣體。
主要特點:
- 高性能: 提供高達 6.0 標準升每分鐘(slm)的氧氣或氧氮混合氣體流量,滿足半導(dǎo)體加工對反應(yīng)性氣體的需求。
- 多種氣體供應(yīng): 支持 100% 氧氣、氬氣或 90% 氧氣/10% 氮氣的點燃氣體供應(yīng),適應(yīng)不同的工藝要求。
- 集成設(shè)計: 將石英真空腔體、射頻(RF)電源和所有必要的控制功能集成在一個緊湊的自包含單元中,便于直接安裝在工具的工藝腔室上。
- 高可靠性: 設(shè)計用于滿足半導(dǎo)體制造環(huán)境的高要求,具有優(yōu)異的耐用性和穩(wěn)定性。
應(yīng)用領(lǐng)域:
該遠程等離子源廣泛應(yīng)用于半導(dǎo)體制造行業(yè),特別是在以下工藝中:
- 薄膜沉積: 用于在硅片表面沉積薄膜。
- 刻蝕: 用于在硅片上刻蝕圖案。
- 清洗: 用于清洗硅片表面,去除有機污染物。
維護與更換:
長期使用可能導(dǎo)致模塊性能下降,定期檢查和更換該模塊可以確保工藝過程的穩(wěn)定性和高效運行。
英文資料:
MKS AX7695 is a remote plasma source produced by MKS Instruments, mainly used to provide reactive gases in semiconductor manufacturing processes.
Main features:
High performance: Provides up to 6.0 standard liters per minute (slm) of oxygen or oxygen nitrogen mixed gas flow, meeting the reactive gas requirements for semiconductor processing.
Multiple gas supply: Supports ignition gas supply of 100% oxygen, argon, or 90% oxygen/10% nitrogen to meet different process requirements.
Integrated design: Integrating the quartz vacuum chamber, radio frequency (RF) power supply, and all necessary control functions into a compact self-contained unit, making it easy to install directly on the tool's process chamber.
High reliability: designed to meet the high requirements of semiconductor manufacturing environments, with excellent durability and stability.
Application areas:
This remote plasma source is widely used in the semiconductor manufacturing industry, especially in the following processes:
Thin film deposition: used to deposit thin films on the surface of silicon wafers.
Etching: Used to etch patterns on silicon wafers.
Cleaning: Used to clean the surface of silicon wafers and remove organic pollutants.
Maintenance and replacement:
Long term use may lead to a decrease in module performance. Regular inspection and replacement of the module can ensure the stability and efficient operation of the process.
2.產(chǎn) 品 展 示

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