AMAT Applied Materials 0190-02506 控制器模塊
1.產(chǎn) 品 資 料 介 紹:
- 多子系統(tǒng)協(xié)同控制:搭載高性能多核處理器(四核 ARM Cortex-A9,主頻 1.2GHz),具備強(qiáng)大的數(shù)據(jù)處理與指令調(diào)度能力,可同時(shí)接入 16 路不同類型子系統(tǒng)接口(包括驅(qū)動(dòng)控制接口、真空監(jiān)測接口、射頻功率接口、傳感器信號(hào)接口),實(shí)現(xiàn)對電機(jī)驅(qū)動(dòng)、真空閥門、射頻發(fā)生器等部件的協(xié)同控制,系統(tǒng)響應(yīng)周期≤1ms,確保各子系統(tǒng)動(dòng)作時(shí)序同步性(偏差≤10μs)。
- 高精度工藝參數(shù)管控:內(nèi)置 24 位高精度 ADC(模數(shù)轉(zhuǎn)換器)與 16 位 DAC(數(shù)模轉(zhuǎn)換器),支持 0-10V 模擬量信號(hào)與數(shù)字量信號(hào)的雙向轉(zhuǎn)換,可實(shí)時(shí)采集并調(diào)控工藝關(guān)鍵參數(shù)(如腔體溫度、氣體流量、射頻功率),參數(shù)測量精度達(dá) ±0.1% FS,控制精度達(dá) ±0.2% FS。例如在刻蝕工藝中,可將腔體溫度穩(wěn)定控制在 ±0.5℃范圍內(nèi),氣體流量控制誤差≤±1sccm,滿足先進(jìn)制程對工藝穩(wěn)定性的要求。
- 靈活的編程與工藝存儲(chǔ):支持 IEC 61131-3 標(biāo)準(zhǔn)編程語言(包括梯形圖、功能塊圖、結(jié)構(gòu)化文本),工程師可根據(jù)不同工藝需求自定義控制邏輯與流程;內(nèi)置大容量存儲(chǔ)單元(8GB NAND Flash + 2GB DDR3),可存儲(chǔ)不少于 100 組完整工藝配方(含工藝參數(shù)、步驟時(shí)序、安全聯(lián)鎖條件),配方調(diào)用時(shí)間≤500ms,實(shí)現(xiàn)多品種芯片制造的快速工藝切換。
- 全方位安全聯(lián)鎖與故障處理:集成 SIL 3 級安全控制單元,預(yù)設(shè) 20 類以上安全聯(lián)鎖邏輯(如真空失壓聯(lián)鎖、射頻過功率聯(lián)鎖、門控未關(guān)聯(lián)鎖),當(dāng)檢測到異常信號(hào)(如腔體壓力驟升 10Pa/s)時(shí),可在 200μs 內(nèi)觸發(fā)緊急停機(jī)指令,同時(shí)切斷危險(xiǎn)子系統(tǒng)電源(如射頻電源、高壓氣體閥門);具備故障自診斷功能,可通過內(nèi)置診斷算法定位故障模塊(如傳感器故障、通信鏈路中斷),診斷準(zhǔn)確率≥95%,并生成詳細(xì)故障報(bào)告(含故障代碼、發(fā)生時(shí)間、可能原因),支持遠(yuǎn)程故障分析與排查。
AMAT Applied Materials 0190-02506 控制器模塊英文資料:
1、 Core positioning and system of the product
The 0190-02506 controller module is the core command component in the semiconductor equipment central control system of Applied Materials Corporation (AMAT), and belongs to the "Equipment Global Control and Collaboration" product line. In the entire process of semiconductor manufacturing, from wafer transfer, process execution to quality monitoring, multiple systems need to work together. This controller module serves as the "device brain" and is specifically adapted to the AMAT Centura series etching equipment and Producer series deposition equipment. By integrating signals from various subsystems (such as drive systems, vacuum systems, and RF systems), it achieves centralized control of equipment operating parameters, automated scheduling of process flows, and rapid response to abnormal situations. It is the core control unit that ensures efficient, stable, and accurate operation of semiconductor equipment.
2、 Analysis of core functions and technical characteristics
Based on the strict requirements of semiconductor equipment for control accuracy, response speed, and compatibility (such as process parameter control error of ≤± 0.5%), the core characteristics of this controller module can be accurately disassembled into the following points:
Multi subsystem collaborative control: Equipped with a high-performance multi-core processor (quad core ARM Cortex-A9, main frequency 1.2GHz), it has powerful data processing and instruction scheduling capabilities, and can simultaneously access 16 different types of subsystem interfaces (including drive control interface, vacuum monitoring interface, RF power interface, sensor signal interface) to achieve collaborative control of motor drive, vacuum valve, RF generator and other components. The system response cycle is ≤ 1ms, ensuring the synchronization of subsystem action timing (deviation ≤ 10 μ s).
High precision process parameter control: Built in 24 bit high-precision ADC (analog-to-digital converter) and 16 bit DAC (digital to analog converter), supporting bidirectional conversion of 0-10V analog signals and digital signals, can real-time collect and control key process parameters (such as chamber temperature, gas flow rate, RF power), with parameter measurement accuracy of ± 0.1% FS and control accuracy of ± 0.2% FS. For example, in etching process, the chamber temperature can be stably controlled within the range of ± 0.5 ℃, and the gas flow control error is ≤ ± 1sccm, meeting the requirements of advanced process for process stability.
Flexible programming and process storage: Supports IEC 61131-3 standard programming language (including ladder diagrams, functional block diagrams, structured text), engineers can customize control logic and processes according to different process requirements; Built in large capacity storage unit (8GB NAND Flash+2GB DDR3), capable of storing no less than 100 complete process recipes (including process parameters, step timing, safety interlock conditions), with recipe call time ≤ 500ms, achieving fast process switching for multi variety chip manufacturing.
Comprehensive safety interlocking and fault handling: Integrated SIL 3 safety control unit, pre-set with more than 20 types of safety interlocking logic (such as vacuum pressure loss interlocking, RF over power interlocking, and door control unassociated locking),
AMAT Applied Materials 0190-02506 控制器模塊 產(chǎn)品展示

產(chǎn)品視頻
3.其他產(chǎn)品
KONGSBERG TRX32?303088過濾器模塊
CCC TMPU-1002? 壓縮機(jī)控制板
CCC FAN-10-2? 壓縮機(jī)模塊
4.其他英文產(chǎn)品
BENTLY 3500/60 163179-01 Monitor card
5SHY3545L0010 3BHB013088R0001 thyristor card
SAC-RL100-M11T Semiconductor encoder
| 6ES5375-0LA15 | CACR-IR10SFB, | 6ES5318-8MB11 |
| 6ES5374-2KL21 | CACR-SR44BY1SD-Y48 | 6DD2920-0XG02 |
| 6ES5374-2FP22 | CACR-SR20TB5BM | 6ES5314-3UA11 |
| 6ES5374-2AL21 | 6SC9111-2AJ45 | 1BF41-0BC0 |
| 6ES5374-2AH21 | CACR-SR30SZ1SD-Y38 | 6DD2920-0XD01 |
| 6ES5374-1KJ11 | 6SC6100-7VA01 | 6DD2920-0XC03 |
| 6ES5374-0AA11 | 6SC6110-0GB00 | 6ES5312-5AA31 |
| 6ES5373-1AA41 | CACR-SR10BB1AM | 6DD2920-0XC02 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218




