AMAT Applied Materials  50419700000 電源總成

1.產(chǎn) 品 資 料 介 紹：

AMAT Applied Materials  50419700000 電源總成 英文資料：

1、 Core positioning and system of the product

The 0010-76968 center finder module is a key positioning component in the semiconductor equipment wafer transfer and positioning system of Applied Materials Corporation (AMAT), belonging to the "high-precision wafer positioning and alignment" product line. In the core processes of semiconductor manufacturing, such as wafer transfer, etching, deposition, coating and development, the precise alignment of the wafer center with the equipment reference axis (with a deviation of ≤± 5 μ m) directly affects the process accuracy and product yield. This module serves as a "wafer positioning navigator" specifically designed for the wafer worktable of AMAT Centura series etching equipment and Lithius Pro coating and developing equipment. Through a combination of optical and mechanical positioning methods, it can identify wafer edges and notches/flat edges in real time, calculate wafer center coordinates, and guide worktable adjustments. It is the core positioning unit that ensures precise docking of wafers in various process stages.

2、 Analysis of core functions and technical characteristics

Based on the strict requirements of semiconductor equipment for wafer positioning accuracy (≤± 3 μ m), positioning speed (≤ 2s/wafer), and compatibility (compatible with 8/12 inch wafers), the core characteristics of the center finder module can be accurately disassembled into the following points:

High precision optical positioning detection: Integrated high-resolution CMOS image sensor (pixel size 3.75 μ m × 3.75 μ m, resolution 2048 × 1080) and 650nm red laser light source, through "laser scanning+image recognition" dual-mode positioning - laser scans along the edge of the wafer in a circular pattern, sensor captures reflected light signals to obtain edge contour data, image recognition algorithm synchronously analyzes wafer notch/flat edge features, positioning accuracy reaches ± 2 μ m, repeat positioning accuracy ≤ ± 1 μ m, suitable for two mainstream wafer sizes of 8 inches (200mm) and 12 inches (300mm), and can be quickly switched without hardware replacement.

Multi dimensional coordinate calculation and calibration: Equipped with a built-in 32-bit floating-point arithmetic processor, it can process more than 2000 edge sampling points obtained from laser scanning in real time. The wafer center coordinates are fitted using the least squares method, and combined with the angle information of notches/flat edges (detection accuracy ± 0.1 °), the deviation between the current position of the wafer and the equipment reference axis (including X/Y axis translation deviation and rotation angle deviation) is calculated. Support dynamic correction function. When the position deviation of the wafer is detected due to transmission vibration, the coordinates can be recalculated within 100ms and adjustment instructions can be output to ensure positioning stability.

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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