AMAT Applied Materials 03-81813-00印刷電路板
1.產(chǎn) 品 資 料 介 紹：
類別 | 規(guī)格 |
基板材質(zhì) | 玻璃纖維增強(qiáng)環(huán)氧樹脂（FR-4），Tg≥150℃ |
布線層數(shù) | 6 層，線寬 / 線距≥3mil/3mil，阻抗控制 ±10% |
接口特性 | 集成 2 路 RS-485、4 路數(shù)字 I/O、2 路電源接口 |
環(huán)境適配 | -10-60℃、濕度＜85%、抗 EMI 干擾（EN 61000-6-2） |
兼容性 | 兼容 AMAT 0100-00985 智能接口板、0225-01622 控制器 |
- 信號(hào)中轉(zhuǎn)處理：接收傳感器（如溫度、壓力傳感器）信號(hào)，經(jīng)濾波、放大后傳輸至控制器，保障數(shù)據(jù)精準(zhǔn)性。
- 執(zhí)行器驅(qū)動(dòng)：輸出控制信號(hào)，驅(qū)動(dòng)氣缸（如 3020-00121）、電磁閥等執(zhí)行元件，實(shí)現(xiàn)設(shè)備動(dòng)作控制。
- 子系統(tǒng)聯(lián)動(dòng)：連接射頻互鎖模塊（如 0100-35565）與主控單元，傳遞安全聯(lián)鎖信號(hào)，保障設(shè)備運(yùn)行安全。
- 安裝：固定于設(shè)備電控板卡插槽，金手指清潔無(wú)氧化，接線端子緊固扭矩 1-1.5N?m。
- 維護(hù)：每 6 個(gè)月檢查焊點(diǎn)無(wú)虛焊、基板無(wú)變形，每年校準(zhǔn)板載信號(hào)放大電路精度，故障優(yōu)先排查接口接觸狀態(tài)。
- 采購(gòu)：優(yōu)先選原廠供應(yīng)商（如長(zhǎng)欣自動(dòng)化），到貨驗(yàn)證基板材質(zhì)報(bào)告與尺寸公差檢測(cè)報(bào)告。
AMAT Applied Materials 03-81813-00印刷電路板 英文資料：
1、 Core positioning
AMAT 03-81813-00 is the "signal processing and control carrier" for semiconductor equipment, responsible for the signal reception, operation processing, and instruction issuance functions of equipment subsystems (such as sensors and actuators). It adopts high-density wiring and anti-interference design, and is suitable for Class 100 clean environments and high-frequency signal transmission scenarios.
2、 Key parameters
Category
Specifications
Substrate material
Glass fiber reinforced epoxy resin (FR-4), Tg ≥ 150 ℃
Number of wiring layers
6 layers, line width/spacing ≥ 3mil/3mil, impedance control ± 10%
Interface characteristics
Integrate 2 RS-485 channels, 4 digital I/O channels, and 2 power interfaces
Environmental adaptation
-10-60 ℃, humidity<85%, anti EMI interference (EN 61000-6-2)
Compatibility
Compatible with AMAT 0100-00985 intelligent interface board and 0225-01622 controller
3、 Core applications
Signal relay processing: Receive sensor signals (such as temperature and pressure sensors), filter and amplify them, and transmit them to the controller to ensure data accuracy.
Actuator driver: outputs control signals to drive actuators such as cylinders (such as 3020-00121) and solenoid valves, achieving device action control.
Subsystem linkage: Connect the RF interlock module (such as 0100-35565) with the main control unit, transmit safety interlock signals, and ensure the safe operation of the equipment.
4、 Key points of operation and maintenance
Installation: Fixed in the slot of the electronic control board of the equipment, with clean and oxidation free gold fingers, and a tightening torque of 1-1.5N · m for the wiring terminals
Maintenance: Check for solder joints and substrate deformation every 6 months, calibrate the accuracy of onboard signal amplification circuits annually, and prioritize troubleshooting interface contact status for faults.
Procurement: Prioritize selecting original suppliers (such as Changxin Automation), and verify the substrate material report and dimensional tolerance inspection report upon arrival.
5、 Technical value
High density wiring improves signal transmission efficiency, anti-interference design reduces environmental interference, is compatible with multiple device components, and reduces the complexity of semiconductor equipment electrical control systems.
AMAT Applied Materials 03-81813-00印刷電路板 產(chǎn)品展示
產(chǎn)品視頻
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
