AMAT Applied Materials 0190-09445 檢測(cè)器
1.產(chǎn) 品 資 料 介 紹:
- 射頻系統(tǒng)狀態(tài)監(jiān)測(cè):安裝于 AMAT 0041-78374 射頻匹配組件與反應(yīng)腔之間的射頻通路,實(shí)時(shí)檢測(cè)射頻反射功率。當(dāng)反射功率超出閾值(如>5W)時(shí),立即向控制器發(fā)送報(bào)警信號(hào),觸發(fā)匹配組件重新調(diào)節(jié)阻抗,避免反射功率過(guò)高損壞射頻電源或影響等離子體穩(wěn)定性。
- 等離子體工藝監(jiān)測(cè):通過(guò)藍(lán)寶石窗口對(duì)準(zhǔn)反應(yīng)腔內(nèi)部等離子體區(qū)域,采集等離子體光強(qiáng)信號(hào)(如刻蝕工藝中 CF? 等離子體的 703nm 特征光譜)??刂破魍ㄟ^(guò)光強(qiáng)變化分析等離子體密度,動(dòng)態(tài)調(diào)整射頻功率、氣體流量等參數(shù),保障刻蝕速率、薄膜沉積質(zhì)量的一致性。
- 腔室環(huán)境安全監(jiān)測(cè):在反應(yīng)腔維護(hù)過(guò)程中,監(jiān)測(cè)腔室內(nèi)殘留等離子體光強(qiáng),當(dāng)光強(qiáng)降至安全閾值(<1μW/cm2)以下時(shí),允許維護(hù)人員開啟腔室,防止殘留等離子體對(duì)人員造成傷害;同時(shí)監(jiān)測(cè)腔室壁面溫度(通過(guò)內(nèi)置溫度傳感元件),避免溫度過(guò)高導(dǎo)致腔室部件老化。
- 設(shè)備故障預(yù)警:長(zhǎng)期監(jiān)測(cè)射頻功率波動(dòng)與等離子體光強(qiáng)穩(wěn)定性,通過(guò)數(shù)據(jù)趨勢(shì)分析提前預(yù)判潛在故障(如射頻線纜老化、匹配組件電容性能衰減),觸發(fā)預(yù)防性維護(hù)提醒,減少非計(jì)劃停機(jī)時(shí)間。
- 主機(jī)設(shè)備適配:廣泛應(yīng)用于 AMAT Centura 刻蝕系統(tǒng)、Endura 沉積平臺(tái)、Producer 薄膜沉積設(shè)備及離子注入機(jī)等依賴射頻與等離子體工藝的半導(dǎo)體設(shè)備。
- 配套模塊兼容:與 AMAT 0190 系列射頻組件、0225 系列控制器、0100 系列電子接口模塊及第三方數(shù)據(jù)采集系統(tǒng)(如 NI cDAQ 系列)直接對(duì)接,形成 “檢測(cè) - 信號(hào)傳輸 - 分析 - 控制” 的閉環(huán)監(jiān)測(cè)體系。
- 協(xié)同組件聯(lián)動(dòng):可與設(shè)備健康管理系統(tǒng)(PHM)聯(lián)動(dòng),將實(shí)時(shí)檢測(cè)數(shù)據(jù)與歷史數(shù)據(jù)對(duì)比,通過(guò)算法識(shí)別異常模式(如射頻功率波動(dòng)頻率增加),自動(dòng)生成故障診斷報(bào)告,輔助運(yùn)維人員精準(zhǔn)定位問(wèn)題。
- 安裝前準(zhǔn)備:確認(rèn)安裝區(qū)域潔凈度符合 Class 10 標(biāo)準(zhǔn),用異丙醇(99.999% 純度)清潔檢測(cè)器表面及法蘭接口;檢查檢測(cè)器外觀無(wú)損傷、藍(lán)寶石窗口無(wú)劃痕,接線端子無(wú)氧化;準(zhǔn)備專用屏蔽線纜(模擬信號(hào)線為雙絞屏蔽線,數(shù)字信號(hào)線為 RS-485 專用線纜)、扭矩扳手(精度 ±5%)及真空密封膠(如 Loctite 577)。
- 硬件安裝:按設(shè)備圖紙將檢測(cè)器通過(guò)法蘭固定在反應(yīng)腔或射頻通路指定位置,確保藍(lán)寶石窗口正對(duì)監(jiān)測(cè)目標(biāo)(等離子體區(qū)域或射頻線纜接頭);法蘭密封面涂抹真空密封膠,扭矩控制在 15-20N?m,確保真空密封等級(jí)≥10?? Torr;連接供電線與信號(hào)線,屏蔽層單端接地(接地電阻≤0.5Ω),避免與射頻線纜平行敷設(shè)。
- 調(diào)試與驗(yàn)證:接入設(shè)備控制系統(tǒng)后,進(jìn)行 “零點(diǎn)校準(zhǔn)” 與 “量程校準(zhǔn)”:射頻檢測(cè)端接入標(biāo)準(zhǔn)功率源(如 100W、300W、500W),校準(zhǔn)輸出信號(hào)與標(biāo)準(zhǔn)值的偏差;光強(qiáng)檢測(cè)端用標(biāo)準(zhǔn)光源(已知光強(qiáng) 10-1000μW/cm2)校準(zhǔn),確保檢測(cè)精度 ±2% FS 內(nèi);設(shè)定報(bào)警閾值(如射頻反射功率>5W、光強(qiáng)波動(dòng)>10%/min),測(cè)試報(bào)警功能是否正常觸發(fā)。
AMAT Applied Materials 0190-09445 檢測(cè)器 英文資料:
Application scenarios and adaptation systems
1. Core application areas
As a "precision monitoring eye" for device status, this detector mainly serves the key links in semiconductor manufacturing that require real-time monitoring of multiple parameters:
RF system status monitoring: Installed in the RF path between the AMAT 0041-78374 RF matching component and the reaction chamber, real-time detection of RF reflected power. When the reflected power exceeds the threshold (such as>5W), an alarm signal is immediately sent to the controller to trigger the matching component to readjust the impedance, avoiding damage to the RF power supply or plasma stability caused by excessive reflected power.
Plasma process monitoring: Align the plasma area inside the reaction chamber through a sapphire window and collect plasma intensity signals (such as the 703nm characteristic spectrum of CF ? plasma in etching process). The controller analyzes the plasma density through changes in light intensity, dynamically adjusts parameters such as RF power and gas flow rate, and ensures consistency in etching rate and thin film deposition quality.
Chamber environment safety monitoring: During the maintenance process of the reaction chamber, the residual plasma intensity inside the chamber is monitored. When the intensity drops below the safety threshold (<1 μ W/cm 2), maintenance personnel are allowed to open the chamber to prevent residual plasma from causing harm to personnel; Simultaneously monitor the temperature of the chamber wall (through built-in temperature sensing elements) to avoid excessive temperature that may cause aging of chamber components.
Equipment fault warning: Long term monitoring of RF power fluctuations and plasma intensity stability, predicting potential faults in advance through data trend analysis (such as RF cable aging, matching component capacitance performance degradation), triggering preventive maintenance reminders, and reducing unplanned downtime.
2. Adapt devices and systems
Host device adaptation: widely used in semiconductor devices such as AMAT Centura etching system, Endura deposition platform, Producer thin film deposition equipment, and ion implantation machines that rely on RF and plasma processes.
Compatibility with supporting modules: Directly interface with AMAT 0190 series RF components, 0225 series controllers, 0100 series electronic interface modules, and third-party data acquisition systems (such as NI cDAQ series) to form a closed-loop monitoring system of "detection signal transmission analysis control".
Collaborative component linkage: It can be linked with the Device Health Management System (PHM) to compare real-time detection data with historical data, identify abnormal patterns (such as increased RF power fluctuation frequency) through algorithms, automatically generate fault diagnosis reports, and assist operation and maintenance personnel in accurately locating problems.
AMAT Applied Materials 0190-09445 檢測(cè)器 產(chǎn)品展示

產(chǎn)品視頻

3.其他產(chǎn)品
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NI CRI0-9073 控制器模塊
A-B 1326AS-B440G-21 電動(dòng)伺服電機(jī)
4.其他英文產(chǎn)品
METSO IOP304 Sequential module
METSO IOP320 Sequential module
METSO IOP331 Servo module
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