AMAT Applied Materials 0190-09597涂抹器組件
1.產(chǎn) 品 資 料 介 紹:
- 精密膠液計(jì)量與輸送:集成容積式陶瓷計(jì)量泵,單次膠液輸送量精度達(dá) ±0.1μL,支持 0.5-50μL 可調(diào)范圍,適配不同晶圓尺寸(8 英寸 / 12 英寸)與光刻膠類(lèi)型(正性 / 負(fù)性、厚膠 / 薄膠)需求。采用 PTFE(聚四氟乙烯)材質(zhì)的輸送管路,內(nèi)壁粗糙度≤0.1μm,可防止膠液殘留與污染,適配光刻膠的化學(xué)惰性要求(如避免與光刻膠中的溶劑發(fā)生反應(yīng))。
- 多模式涂覆適配設(shè)計(jì):支持旋涂、狹縫涂布兩種主流涂覆模式 —— 旋涂狀態(tài)下,配合 1000-10000rpm 可調(diào)轉(zhuǎn)速的晶圓吸盤(pán),通過(guò)離心力實(shí)現(xiàn)膠液均勻延展;狹縫涂布模式下,通過(guò)精密線性導(dǎo)軌驅(qū)動(dòng)涂覆頭移動(dòng),涂覆速度 0.1-5m/s 可調(diào),涂覆寬度誤差≤±0.5mm,適配先進(jìn)制程中厚膠涂覆(如 MEMS 結(jié)構(gòu))的高精度需求。
- 微米級(jí)厚度控制能力:內(nèi)置激光干涉厚度傳感器,實(shí)時(shí)監(jiān)測(cè)涂覆過(guò)程中的膠膜厚度,測(cè)量精度達(dá) ±0.5nm,配合 PID 閉環(huán)控制算法調(diào)節(jié)膠液輸送量與涂覆速度,可將晶圓表面光刻膠厚度波動(dòng)控制在 ±1% 以內(nèi)。涂覆頭采用金剛石研磨噴嘴,噴嘴縫隙寬度精度達(dá) ±1μm,確保膠液出膠均勻性,避免邊緣 bead 效應(yīng)(膠液在晶圓邊緣堆積)。
AMAT Applied Materials 0190-09597涂抹器組件 英文資料:
1、 Core positioning and system of the product
The 0190-09597 applicator component is a key process execution component in the semiconductor coating and development equipment (Track) of Applied Materials Company (AMAT), and belongs to the "photoresist precision coating system" product line. In the coating process of wafer lithography, the photoresist needs to evenly cover the surface of the wafer to form a thin film. This component serves as the "coating accuracy terminal" and is specially adapted to high-end coating and development equipment such as AMAT Lithium Pro and Endura Track. Through precise adhesive liquid transportation and coating structure, it achieves quantitative distribution, uniform extension, and thickness control of the photoresist, which is the core execution unit to ensure the transfer accuracy of lithography patterns and improve chip process yield.
2、 Analysis of core functions and technical characteristics
Considering the strict requirements for uniformity and accuracy in semiconductor photoresist coating (such as a thickness deviation of ≤± 1nm for 7nm process photoresist), the core characteristics of this applicator component can be accurately disassembled into the following points:
Precision glue measurement and transportation: Integrated volumetric ceramic metering pump, with a single glue transportation accuracy of ± 0.1 μ L, supporting an adjustable range of 0.5-50 μ L, suitable for different wafer sizes (8 inches/12 inches) and photoresist types (positive/negative, thick/thin) requirements. The conveying pipeline made of PTFE (polytetrafluoroethylene) material has an inner wall roughness of ≤ 0.1 μ m, which can prevent residue and contamination of the photoresist and meet the chemical inertness requirements of photoresist (such as avoiding reaction with solvents in photoresist).
Multi mode coating adaptation design: supports two mainstream coating modes: spin coating and slit coating. In the spin coating state, it is combined with a wafer suction cup with adjustable speed of 1000-10000rpm to achieve uniform extension of the adhesive liquid through centrifugal force; In the slit coating mode, the coating head is driven by a precision linear guide to move, with an adjustable coating speed of 0.1-5m/s and a coating width error of ≤± 0.5mm, suitable for high-precision requirements of thick adhesive coating in advanced processes such as MEMS structures.
Micron level thickness control capability: Equipped with a built-in laser interference thickness sensor, it can monitor the thickness of the coating film in real time, with a measurement accuracy of ± 0.5nm. Combined with PID closed-loop control algorithm, it can adjust the amount of coating solution and coating speed, and control the fluctuation of photoresist thickness on the wafer surface within ± 1%. The coating head adopts a diamond grinding nozzle, with a nozzle gap width accuracy of ± 1 μ m, ensuring the uniformity of the adhesive liquid and avoiding edge bead effect (adhesive liquid accumulates at the edge of the wafer).
AMAT Applied Materials 0190-09597涂抹器組件 產(chǎn)品展示

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