AMAT Applied Materials 0021-09550底盤
1.產(chǎn) 品 資 料 介 紹：
- 高剛性材質(zhì)選型：采用冷軋鋼板（厚度 3-5mm）或鋁合金型材（6061-T6）作為主體材質(zhì)，冷軋鋼板屈服強度≥235MPa，鋁合金型材抗拉強度≥310MPa，兼具輕量化與高承重能力，可承載設備內(nèi)部電源模塊、控制單元、傳動機構(gòu)等組件（最大承載重量≥50kg），長期使用無明顯形變（形變量≤0.1mm/m），避免因結(jié)構(gòu)變形導致模塊錯位、線路接觸不良。
- 模塊化分區(qū)布局：根據(jù)半導體設備模塊功能需求，劃分獨立安裝區(qū)域，如電源艙、控制艙、散熱艙等，各區(qū)域通過可拆卸隔板分隔，隔板厚度≥2mm，且預留標準化安裝孔位（孔徑 4-6mm，孔距 25-50mm），適配 AMAT 設備內(nèi)部 PCB 板、驅(qū)動器、傳感器等組件的安裝尺寸，無需額外打孔改造，降低設備集成難度，同時便于模塊單獨檢修與更換。
- 抗震與穩(wěn)定性優(yōu)化：底盤底部配備防震腳墊（材質(zhì)為丁腈橡膠，硬度 50±5 Shore A），可吸收設備運行時機械振動（振動衰減率≥80%），減少振動對精密模塊（如晶圓傳輸機構(gòu)、檢測傳感器）的影響；同時底盤四角設置加固角鋼（厚度≥4mm），提升整體抗扭強度（抗扭剛度≥150N?m/°），避免設備搬運或安裝過程中因外力沖擊導致結(jié)構(gòu)損壞。
- 防塵與潔凈兼容：外殼采用全封閉結(jié)構(gòu)，防護等級達 IP65，面板縫隙處配備發(fā)泡硅膠密封條（壓縮量 30%-50%），可有效阻擋潔凈車間的微塵顆粒（粒徑≥0.1μm）侵入底盤內(nèi)部，避免粉塵附著在電路板、連接器表面導致的短路或信號干擾；同時底盤表面采用電解拋光處理（表面粗糙度 Ra≤0.8μm），不易積塵且便于清潔，符合半導體行業(yè) ISO Class 5 潔凈室標準。
AMAT Applied Materials 0021-09550底盤 英文資料：
1、 High strength structural design: Building a solid foundation for semiconductor equipment support
As the "skeleton carrier" of semiconductor equipment, the 0021-09550 chassis is designed with a stable and durable structure as its core, providing reliable support and installation space for precision modules inside the equipment
High rigidity material selection: Cold rolled steel plate (thickness 3-5mm) or aluminum alloy profile (6061-T6) is used as the main material. The yield strength of cold-rolled steel plate is ≥ 235MPa, and the tensile strength of aluminum alloy profile is ≥ 310MPa. It has both lightweight and high load-bearing capacity, and can carry internal components such as power modules, control units, and transmission mechanisms of equipment (maximum load-bearing weight ≥ 50kg). Long term use has no significant deformation (deformation ≤ 0.1mm/m), avoiding module misalignment and poor line contact caused by structural deformation.
Modular partition layout: Based on the functional requirements of semiconductor equipment modules, independent installation areas are divided, such as power supply cabin, control cabin, heat dissipation cabin, etc. Each area is separated by removable partitions with a thickness of ≥ 2mm, and standardized installation holes are reserved (hole diameter 4-6mm, hole spacing 25-50mm) to adapt to the installation size of internal PCB boards, drivers, sensors and other components of AMAT equipment, without the need for additional drilling and modification, reducing the difficulty of equipment integration, and facilitating separate maintenance and replacement of modules.
Seismic and stability optimization: The bottom of the chassis is equipped with shock-absorbing foot pads (made of nitrile rubber with a hardness of 50 ± 5 Shore A), which can absorb mechanical vibrations during equipment operation (vibration attenuation rate ≥ 80%) and reduce the impact of vibrations on precision modules such as wafer transfer mechanisms and detection sensors; At the same time, reinforced angle steel (thickness ≥ 4mm) is installed at the four corners of the chassis to enhance the overall torsional strength (torsional stiffness ≥ 150N · m/°), avoiding structural damage caused by external impact during equipment handling or installation.
2、 Comprehensive protection performance: resistant to complex environments in semiconductor manufacturing
In response to the harsh environment inside semiconductor cleanrooms and equipment, the 0021-09550 chassis has upgraded its protective design to ensure the safe operation of internal modules
Dustproof and clean compatibility: The shell adopts a fully enclosed structure with a protection level of IP65. Foam silicone sealing strips (compression capacity of 30% -50%) are equipped at the panel gaps, which can effectively prevent fine dust particles (particle size ≥ 0.1 μ m) from entering the interior of the chassis in the clean workshop, avoiding short circuits or signal interference caused by dust adhering to the surface of circuit boards and connectors; At the same time, the chassis surface is treated with electrolytic polishing (surface roughness Ra ≤ 0.8 μ m), which is not easy to accumulate dust and is easy to clean, meeting the ISO Class 5 cleanroom standard of the semiconductor industry.
AMAT Applied Materials 0021-09550底盤 產(chǎn)品展示
產(chǎn)品視頻
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| 710-303063-00 | 6DD1684-0EA0 | F31X133PRUAPG1 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
