AMAT Applied Materials 0100-40024互連板
1.產(chǎn) 品 資 料 介 紹：
- 多類型接口集成適配：集成多種工業(yè)級接口，涵蓋信號接口（如 LVDS、SPI、I2C）、電力接口（如端子式電源接口）及數(shù)據(jù)傳輸接口（如 Ethernet、USB），可同時實現(xiàn)設(shè)備控制系統(tǒng)（如 PLC）、傳感器模塊、執(zhí)行機(jī)構(gòu)（如伺服電機(jī)）與顯示單元間的連接，無需額外轉(zhuǎn)接模塊，簡化設(shè)備內(nèi)部布線，減少信號傳輸節(jié)點(diǎn)，降低信號衰減與干擾風(fēng)險。
- 低阻抗信號傳輸設(shè)計：采用高純度銅質(zhì)導(dǎo)電線路（電阻率≤1.72×10??Ω?m），線路寬度根據(jù)電流與信號頻率優(yōu)化設(shè)計（信號線路寬度≥0.2mm，電力線路寬度≥1mm），同時通過阻抗匹配技術(shù)（特性阻抗控制在 50Ω±5%、100Ω±5%），確保高頻信號（如 1GHz 以上的數(shù)據(jù)信號）傳輸時反射損耗≤-20dB，信號傳輸速率可達(dá) 10Gbps 以上，滿足半導(dǎo)體設(shè)備高速數(shù)據(jù)交互需求，避免因信號延遲導(dǎo)致的工藝控制偏差。
- 多通道獨(dú)立供電分配：具備獨(dú)立的電力分配通道，支持 12V DC、24V DC、48V DC 等多種電壓輸出，單通道最大承載電流達(dá) 10A，且通道間采用隔離設(shè)計（隔離電壓≥1500V AC），可分別為設(shè)備不同功率需求的模塊供電（如低功率傳感器與高功率驅(qū)動電機(jī)），防止單一模塊供電異常影響其他模塊，保障設(shè)備整體供電穩(wěn)定性。
- 小型化與輕量化設(shè)計：采用超薄基板（厚度≤1.6mm），整體尺寸符合工業(yè)標(biāo)準(zhǔn)板卡規(guī)格（如 100mm×150mm、120mm×180mm），重量≤100g，可適配設(shè)備內(nèi)部狹窄安裝空間（如設(shè)備背板、模塊間隙），同時減輕設(shè)備整體重量，便于設(shè)備組裝與維護(hù)。
- 堆疊式與模塊化布局：支持堆疊式安裝，通過板對板連接器實現(xiàn)多塊互連板的垂直堆疊，堆疊間距≥5mm，確保散熱空間充足；同時采用模塊化布局，將接口區(qū)域、信號處理區(qū)域與電力分配區(qū)域分區(qū)設(shè)計，各區(qū)域間設(shè)置屏蔽隔板，減少不同類型信號間的干擾，且便于針對特定區(qū)域進(jìn)行檢修與更換，提升維護(hù)效率。
AMAT Applied Materials 0100-40024互連板 英文資料：
1、 Efficient circuit connection: ensuring stable transmission of semiconductor equipment signals and power
As the "connection bridge" between various modules of semiconductor equipment, the 0100-40024 interconnect board focuses on efficient and stable circuit connection capabilities to meet the complex signal interaction and power distribution needs of the equipment
Multi type interface integration and adaptation: Integrating multiple industrial grade interfaces, including signal interfaces (such as LVDS, SPI, I2C), power interfaces (such as terminal power interfaces), and data transmission interfaces (such as Ethernet, USB), it can simultaneously connect equipment control systems (such as PLC), sensor modules, actuators (such as servo motors), and display units without the need for additional adapter modules, simplifying internal wiring of equipment, reducing signal transmission nodes, and minimizing signal attenuation and interference risks.
Low impedance signal transmission design: High purity copper conductive lines (resistivity ≤ 1.72 × 10 ??Ω· m) are used, and the line width is optimized according to the current and signal frequency (signal line width ≥ 0.2mm, power line width ≥ 1mm). At the same time, impedance matching technology (characteristic impedance controlled at 50 Ω± 5%, 100 Ω± 5%) is used to ensure that the reflection loss during high-frequency signal transmission (such as data signals above 1GHz) is ≤ -20dB, and the signal transmission rate can reach 10Gbps or more, meeting the high-speed data exchange requirements of semiconductor equipment and avoiding process control deviations caused by signal delay.
Multi channel independent power supply distribution: it has independent power distribution channels, supports 12V DC, 24V DC, 48V DC and other voltage outputs, the maximum carrying current of a single channel is 10A, and isolation design (isolation voltage ≥ 1500V AC) is adopted between channels, which can supply power to modules with different power requirements of the equipment (such as low-power sensors and high-power drive motors), prevent abnormal power supply of a single module from affecting other modules, and ensure the overall power supply stability of the equipment.
2、 Compact structural design: adapted to the spatial layout requirements of semiconductor equipment
In response to the compact internal space and module density of semiconductor devices, the 0100-40024 interconnect board focuses on miniaturization and compatibility in structural design to improve equipment space utilization:
Miniaturization and Lightweight Design: Adopting ultra-thin substrate (thickness ≤ 1.6mm), the overall size meets the industrial standard board specifications (such as 100mm × 150mm, 120mm × 180mm), weight ≤ 100g, and can adapt to narrow installation spaces inside the equipment (such as equipment backboards and module gaps), while reducing the overall weight of the equipment and facilitating equipment assembly and maintenance.
Stackable and modular layout: Supports stacked installation, achieving vertical stacking of multiple interconnected boards through board to board connectors, with a stacking spacing of ≥ 5mm, ensuring sufficient heat dissipation space; At the same time, a modular layout is adopted to partition the interface area, signal processing area, and power distribution area. Shielding partitions are installed between each area to reduce interference between different types of signals, and to facilitate maintenance and replacement for specific areas, thereby improving maintenance efficiency.
AMAT Applied Materials 0100-40024互連板 產(chǎn)品展示
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| 710-608020-01 | 193X740ACG01 | 531X309PCAJG1 |
| 710-606238-005 | 193X803BCG03 | 073-614993-000 |
| 710-606238-00 | 6DD1684-0FB0 | 500-22333-001 |
| 710-566009-00 | 6DD1684-0EF0 | 710-660800-00 |
| 710-566008-00 | 03-417236-00 | 720-06888-001 |
| 710-566006-00 | A90-031-03 | 710-658177-20 |
| 710-5000817-00 | 531X111PSHABG1 | F31X128HMSA |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
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