AMAT Applied Materials PAM-BKP3印刷電路板
1.產(chǎn) 品 資 料 介 紹：
- 高密度布線與信號(hào)優(yōu)化：采用多層板設(shè)計(jì)（推測為 8-12 層），布線密度達(dá) 180 線 / 英寸，可集成大量精密元器件（如貼片電阻、電容、芯片），同時(shí)通過阻抗匹配設(shè)計(jì)（特性阻抗控制在 50Ω±10%、75Ω±10%），優(yōu)化高頻信號(hào)（如 100MHz 以上的控制信號(hào)、傳感器采集信號(hào)）傳輸性能，減少信號(hào)反射與衰減，確保半導(dǎo)體設(shè)備工藝參數(shù)（如溫度、壓力）傳輸誤差≤0.1%，避免因信號(hào)失真導(dǎo)致的工藝偏差。
- 多信號(hào)類型兼容集成：支持?jǐn)?shù)字信號(hào)（如 TTL/CMOS 電平信號(hào)）、模擬信號(hào)（如 4-20mA 電流信號(hào)、0-10V 電壓信號(hào)）與功率信號(hào)（如驅(qū)動(dòng)電機(jī)的高電壓信號(hào)）的同步傳輸，不同類型信號(hào)線路間設(shè)置隔離帶（寬度≥0.2mm）與接地屏蔽層，隔離度≥60dB，防止信號(hào)串?dāng)_，保障設(shè)備控制系統(tǒng)（如 PLC）、執(zhí)行機(jī)構(gòu)（如伺服電機(jī)）、監(jiān)測模塊（如熱電偶）之間的信號(hào)獨(dú)立穩(wěn)定傳輸。
- 冗余設(shè)計(jì)提升可靠性：關(guān)鍵電路（如電源供電電路、核心控制芯片連接電路）采用冗余設(shè)計(jì)，配備備用線路與元器件，當(dāng)主電路出現(xiàn)故障時(shí)，冗余電路可在 10ms 內(nèi)自動(dòng)切換，確保半導(dǎo)體設(shè)備核心功能（如晶圓傳輸、工藝腔溫度控制）不中斷，避免因電路板故障導(dǎo)致的設(shè)備停機(jī)與晶圓報(bào)廢，提升設(shè)備運(yùn)行可靠性。
- 基板材質(zhì)與性能：采用 FR-4 環(huán)氧樹脂玻璃布基板（Tg 值≥170℃），具備優(yōu)異的耐高溫性能，在半導(dǎo)體設(shè)備高溫區(qū)域（如靠近加熱腔的 60-80℃環(huán)境）長期運(yùn)行時(shí)，基板熱變形量≤0.2%，無開裂、分層現(xiàn)象；同時(shí)基板介電常數(shù)穩(wěn)定（1MHz 下介電常數(shù)≤4.5），介電損耗≤0.02，確保高頻信號(hào)傳輸性能穩(wěn)定，不受溫度變化影響。
- 導(dǎo)體與涂層工藝：導(dǎo)體采用電解銅箔（厚度≥35μm），銅箔附著力≥1.5N/mm，經(jīng)過沉金工藝處理（金層厚度≥2μm），具備優(yōu)異的導(dǎo)電性（電阻率≤1.7×10??Ω?m）與抗腐蝕性能，可抵御潔凈車間微量腐蝕性氣體（如刻蝕工藝中的氟化物殘留）侵蝕，避免導(dǎo)體氧化導(dǎo)致的接觸電阻增大；表面涂層采用阻焊油墨（綠油），絕緣性能優(yōu)異（擊穿電壓≥20kV/mm），同時(shí)具備防刮擦、防指紋特性，便于設(shè)備維護(hù)時(shí)的操作。
AMAT Applied Materials PAM-BKP3印刷電路板 英文資料：
1、 High precision circuit design: adapted to the signal transmission requirements of semiconductor equipment
As the "circuit hub" of semiconductor equipment, PAM-BKP3 printed circuit board takes high-precision circuit layout as its core, meeting the stable transmission and precise control requirements of complex signals in equipment:
High density wiring and signal optimization: Adopting a multi-layer board design (estimated to be 8-12 layers), the wiring density reaches 180 wires/inch, which can integrate a large number of precision components (such as chip resistors, capacitors, chips). At the same time, through impedance matching design (characteristic impedance controlled at 50 Ω± 10%, 75 Ω± 10%), the transmission performance of high-frequency signals (such as control signals above 100MHz and sensor acquisition signals) is optimized, reducing signal reflection and attenuation, ensuring that the transmission error of semiconductor equipment process parameters (such as temperature and pressure) is ≤ 0.1%, and avoiding process deviations caused by signal distortion.
Multi signal type compatible integration: supports synchronous transmission of digital signals (such as TTL/CMOS level signals), analog signals (such as 4-20mA current signals, 0-10V voltage signals), and power signals (such as high voltage signals for driving motors). Isolation tapes (width ≥ 0.2mm) and grounding shielding layers are set between different types of signal lines, with an isolation degree ≥ 60dB, to prevent signal crosstalk and ensure independent and stable signal transmission between equipment control systems (such as PLC), actuators (such as servo motors), and monitoring modules (such as thermocouples).
Redundancy design enhances reliability: Key circuits (such as power supply circuits and core control chip connection circuits) adopt redundancy design, equipped with backup lines and components. When the main circuit fails, the redundant circuit can automatically switch within 10ms, ensuring that the core functions of semiconductor equipment (such as wafer transfer and process chamber temperature control) are not interrupted, avoiding equipment downtime and wafer scrap caused by circuit board failures, and improving equipment operation reliability.
2、 High durability material selection: ensuring long-term stable operation
Based on AMAT's specialized material standards for the semiconductor industry, PAM-BKP3 printed circuit boards prioritize durability and stability in material selection to extend their lifespan
Substrate material and performance: FR-4 epoxy resin glass cloth substrate (Tg value ≥ 170 ℃) is used, which has excellent high temperature resistance. When operating in high-temperature areas of semiconductor equipment (such as 60-80 ℃ environment near the heating chamber) for a long time, the thermal deformation of the substrate is ≤ 0.2%, and there is no cracking or delamination phenomenon; At the same time, the substrate has a stable dielectric constant (dielectric constant ≤ 4.5 at 1MHz) and a dielectric loss ≤ 0.02, ensuring stable high-frequency signal transmission performance and not affected by temperature changes.
Conductor and coating process: The conductor is made of electrolytic copper foil (thickness ≥ 35 μ m), with a copper foil adhesion of ≥ 1.5N/mm. After being treated with gold deposition process (gold layer thickness ≥ 2 μ m), it has excellent conductivity (resistivity ≤ 1.7 × 10 ΩΩ· m) and corrosion resistance, and can resist the erosion of trace corrosive gases in clean workshops (such as fluoride residues in etching process)
AMAT Applied Materials PAM-BKP3印刷電路板 產(chǎn)品展示
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| 710-651090-20 | 8055-SCP-655 | 820-06553-000 |
| 710-650879-20 | 8055-SCP-654 | 4007-001-0089 |
| 710-650204-20 | 8055-SCP-453 | 710-650074-20 |
| 710-650201-20 | 8055-SCP-654R | F31X170TBSADG1 |
| 710-650094-20 | 8030-CRM-230 | 740-607108-005 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
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