AMAT Applied Materials 0040-32530冷盤(pán)組件
1.產(chǎn) 品 資 料 介 紹：
AMAT Applied Materials 0040-32530 冷盤(pán)組件
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AMAT Applied Materials 0040-32530冷盤(pán)組件 英文資料：
AMAT Applied Materials 0040-32530 Cold Plate Component
AMAT 0040-32530 cold plate component is a key thermal management component in semiconductor manufacturing equipment, mainly used for precise temperature control of wafers during the process. It achieves uniform cooling of wafers through refrigeration media or semiconductor refrigeration technology, ensuring process stability and repeatability.
Core specifications
Project specification remarks
Compatible with 200mm/300mm wafers on platforms such as Centura, Endura, P5000, etc
Temperature control range -20 ° C~80 ° C, accuracy up to ± 0.1 ° C
Cooling method: Water cooling/refrigerant circulation/semiconductor refrigeration depends on the specific model
Temperature uniformity ≤± 0.5 ° C on the entire wafer surface
Maximum vacuum degree 1 × 10 ?? Torr suitable for high vacuum process environment
Material: 316L stainless steel/aluminum alloy, corrosion-resistant, low particle design
Interface type standard VCR/card sleeve interface for connecting cooling medium
Customized size design to fit specific equipment chambers
Features
High precision temperature control: using advanced temperature control algorithms to achieve precise control of wafer surface temperature
Excellent temperature uniformity: Optimized cooling channel design ensures consistent temperature across the entire wafer surface
High vacuum compatibility: Special sealing design to meet the requirements of high vacuum environments
Corrosion resistant design: using corrosion-resistant materials suitable for various process environments
Low particle generation: special surface treatment to reduce the risk of particle contamination
Modular design: easy to maintain and ｒｅｐｌａｃｅ, reducing equipment downtime
Typical Applications
Temperature control of wafers in etching process
Substrate cooling during thin film deposition process
Temperature regulation of wafers before ion implantation
Various semiconductor manufacturing processes that require precise temperature control
Key points for installation and maintenance
Installation precautions:
Ensure that the sealing surface between the cold plate and the chamber is clean and free of scratches
Tighten the connecting bolts according to the prescribed torque
Check the sealing status of the cooling medium interface
Usage suggestions:
Confirm that the flow rate and pressure of the cooling medium are normal before starting
Avoid rapid temperature changes and protect seals
Regularly check temperature uniformity
Maintenance cycle:
Check the sealing condition every 6 months
Conduct a comprehensive performance test once a year
ｒｅｐｌａｃｅ vulnerable parts according to the equipment manual requirements
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The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
