AMAT Applied Materials 0010-09416射頻匹配組件

1.產(chǎn) 品 資 料 介 紹：

產(chǎn)品概述

AMAT 0010-09416 射頻匹配組件（RF Matching Network Assembly）是應(yīng)用材料公司半導體設(shè)備中的關(guān)鍵射頻子系統(tǒng)模塊。其主要作用是將射頻電源與工藝腔體之間的阻抗進行實時匹配，從而確保射頻能量高效傳輸?shù)降入x子體，提升等離子體的穩(wěn)定性與均勻性，廣泛應(yīng)用于刻蝕（Etch）、CVD、PVD 等等離子體工藝設(shè)備。

技術(shù)參數(shù)（典型特征）

• 模塊類型：射頻匹配網(wǎng)絡(luò)（RF Matching Network）

• 主要功能：射頻阻抗自動匹配、能量傳輸優(yōu)化

• 頻率范圍：常用于 13.56 MHz、27 MHz 等半導體行業(yè)標準頻率

• 功率處理能力：可承受數(shù)百瓦到數(shù)千瓦級的射頻功率（依設(shè)備配置）

• 控制方式：支持自動調(diào)諧和實時反饋，保證腔體工藝穩(wěn)定性

• 兼容設(shè)備：Applied Materials 等離子刻蝕機、PVD/CVD 沉積設(shè)備

應(yīng)用場景

1. 等離子體刻蝕工藝

   • 在硅片刻蝕中維持穩(wěn)定的等離子體，確?？涛g深度與形貌均勻。

2. 薄膜沉積（PVD、CVD）

   • 在沉積過程中保持功率穩(wěn)定傳輸，提高膜層厚度和成分均勻性。

3. 離子注入和表面處理

   • 控制離子能量和分布，保障注入劑量和表面改性的一致性。

4. 制程良率提升

   • 通過精準射頻控制減少偏差，降低工藝不良率。

產(chǎn)品優(yōu)勢

• 高匹配效率：優(yōu)化射頻能量耦合，降低反射功率損耗。

• 實時自動調(diào)諧：可根據(jù)工藝腔體條件變化自動調(diào)整匹配狀態(tài)。

• 穩(wěn)定性強：在高功率、高頻率下仍保持長期穩(wěn)定運行。

• 模塊化設(shè)計：便于快速更換和維修，縮短設(shè)備停機時間。

• 提升工藝一致性：幫助獲得更均勻的等離子體分布，提高芯片生產(chǎn)良率。

AMAT Applied Materials 0010-70131監(jiān)視器模塊 英文資料：

Product Overview

AMAT 0010-09416 RF Matching Network Assembly is a key RF subsystem module in Applied Materials' semiconductor equipment. Its main function is to match the impedance between the RF power supply and the process chamber in real time, thereby ensuring efficient transmission of RF energy to the plasma, improving the stability and uniformity of the plasma, and widely used in plasma process equipment such as etching (Etch), CVD, PVD, etc.

Technical parameters (typical features)

Module type: RF Matching Network

Main functions: automatic matching of RF impedance, optimization of energy transmission

Frequency range: commonly used for semiconductor industry standard frequencies such as 13.56 MHz and 27 MHz

Power processing capability: capable of withstanding RF power ranging from several hundred watts to several thousand watts (depending on device configuration)

Control mode: Supports automatic tuning and real-time feedback to ensure the stability of the cavity process

Compatible equipment: Applied Materials plasma etching machine, PVD/CVD deposition equipment

Application scenarios

Plasma etching process

Maintain stable plasma during silicon wafer etching to ensure uniform etching depth and morphology.

Thin film deposition (PVD, CVD)

Maintain stable power transmission during the sedimentation process, and improve the thickness and composition uniformity of the film layer.

Ion implantation and surface treatment

Control ion energy and distribution to ensure consistency in injection dose and surface modification.

Process yield improvement

Reduce deviation and decrease process defect rate through precise RF control.

Product advantages

High matching efficiency: Optimize RF energy coupling and reduce reflected power loss.

Real time automatic tuning: The matching status can be automatically adjusted according to changes in the process chamber conditions.

Strong stability: It can maintain long-term stable operation even at high power and high frequency.

Modular design: facilitates quick replacement and maintenance, reducing equipment downtime.

Improve process consistency: Help achieve a more uniform plasma distribution and improve chip production yield.

AMAT Applied Materials 0010-70131監(jiān)視器模塊 產(chǎn)品展示      

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