Huttinger  C40-0851 C40-0851.02射頻單元板

1.產(chǎn) 品 資 料 介 紹：

 Huttinger  C40-0851 C40-0851.02射頻單元板  英文資料：

HUTTINGER C40-0851/C40-0851.02 RF Unit Board Introduction

The HUTTINGER C40-0851/C40-0851.02 RF unit board is a core component focused on industrial grade high-precision RF signal processing, designed specifically for RF power amplification, signal modulation, and stable output scenarios, with "low noise, high stability, and strong adaptability" as its core characteristics. It integrates RF signal amplification, filtering, power detection, and real-time control functions, seamlessly integrating with Huttinger series RF controllers (such as C40-854-01), signal generators, and backend load devices to build a complete RF link of "signal input processing amplification monitoring". It provides pure and stable RF energy output for fields such as semiconductor manufacturing, material processing, scientific research and testing that require strict RF signal quality, effectively ensuring the accuracy and consistency of downstream processes.

1、 Product Overview

HUTTINGER C40-0851/C40-0851.02 RF unit board is positioned in the mid to high end industrial RF field, with the core solution of "low-noise amplification of RF signals, stable power output, and multi scene adaptation". Its hardware architecture is built around high-performance RF amplification chips, precision filtering networks, and real-time power detection units. Through optimized impedance matching design and electromagnetic compatibility layout, it achieves the dual goal of "pure input signal processing+precise output power control" - it can amplify the weak RF signal (such as -10dBm~0dBm) of the front-end signal generator to the required power for industrial applications (up to 10W~100W depending on the model), and can also provide real-time feedback on the output status through the built-in power detection circuit, cooperate with the controller to achieve closed-loop adjustment, ensure that the power fluctuation during long-term operation is ≤ ± 0.1dB, and meet the strict requirements of RF energy stability in semiconductor etching, RF sputtering and other scenarios.

This unit board is designed to meet the complex requirements of industrial scenarios: it uses military grade RF components and all metal shielded cavities, which can withstand a wide temperature range of -20 ℃~+70 ℃, moderate mechanical vibration (in accordance with IEC 60068-2-6 standard) and impact (in accordance with IEC 60068-2-27 standard), and is suitable for diverse environments such as semiconductor clean rooms, industrial production lines, and research laboratories; The compact board design can be flexibly embedded into standard RF system chassis or racks, supporting parallel expansion of multiple unit boards (such as 2-4 boards working together), meeting different power level requirements, and providing a cost-effective and highly adaptable solution for small and medium power RF applications.

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