AMAT Applied Materials  0010-76136加熱器

1.產(chǎn) 品 資 料 介 紹：

產(chǎn)品概述

AMAT 0010-76136 加熱器是 Applied Materials 半導(dǎo)體設(shè)備中的核心加熱元件，用于在工藝腔體或相關(guān)組件中提供穩(wěn)定、可控的熱量。它通過精準(zhǔn)的溫度控制，確保沉積、刻蝕、擴(kuò)散等工藝所需的熱環(huán)境。該部件通常作為備件用于設(shè)備維護(hù)和更換，以保證工藝的連續(xù)性和一致性。

技術(shù)參數(shù)（推斷類信息，具體數(shù)值因型號不同會有差異）

• 功能類型：半導(dǎo)體工藝設(shè)備專用加熱器

• 安裝位置：工藝腔體、腔體法蘭、氣體通道或晶圓托盤區(qū)域

• 供電方式：常見為交流電加熱（110V / 220V AC），具體根據(jù)設(shè)備配置

• 功率范圍：通常在數(shù)百瓦至數(shù)千瓦之間，滿足不同工藝加熱需求

• 溫度控制：支持精密控制，可與熱電偶或紅外傳感器閉環(huán)控制

• 材質(zhì)特性：采用高溫合金或陶瓷基材料，具備耐腐蝕與耐高溫性能

• 工作環(huán)境：高真空、潔凈室工藝條件

應(yīng)用場景

1. 化學(xué)氣相沉積 (CVD) / 物理氣相沉積 (PVD)

   • 加熱工藝腔體或襯底，保證薄膜沉積速率與均勻性。

2. 刻蝕工藝

   • 控制腔體壁溫度，減少副產(chǎn)物沉積并改善刻蝕一致性。

3. 離子注入

   • 對載片或腔體進(jìn)行適度加熱，保證工藝穩(wěn)定性和摻雜效果。

4. 氣體流路 / 腔體加熱

   • 避免氣體在管路或腔體內(nèi)冷凝，提高氣體輸運(yùn)效率與純度。

5. 晶圓熱處理

   • 為部分工藝提供熱循環(huán)，改善晶圓表面結(jié)構(gòu)或應(yīng)力釋放。

AMAT Applied Materials 0010-76136加熱器 英文資料：

Product Overview

AMAT 0010-76136 heater is the core heating element in Applied Materials semiconductor equipment, used to provide stable and controllable heat in process chambers or related components. It ensures the thermal environment required for deposition, etching, diffusion and other processes through precise temperature control. This component is usually used as a spare part for equipment maintenance and replacement to ensure the continuity and consistency of the process.

Technical parameters (inferential information, specific values may vary depending on the model)

Function type: Special heater for semiconductor process equipment

Installation location: Process chamber, chamber flange, gas channel or wafer tray area

Power supply method: commonly used for AC heating (110V/220V AC), depending on the equipment configuration

Power range: typically between several hundred watts to several kilowatts, to meet different heating requirements for various processes

Temperature control: supports precision control and can be closed-loop controlled with thermocouples or infrared sensors

Material characteristics: Made of high-temperature alloy or ceramic based materials, with corrosion resistance and high temperature resistance properties

Working environment: high vacuum, clean room process conditions

Application scenarios

Chemical Vapor Deposition (CVD)/Physical Vapor Deposition (PVD)

Heat the process chamber or substrate to ensure the deposition rate and uniformity of the thin film.

etching process

Control the temperature of the cavity wall, reduce the deposition of by-products, and improve etching consistency.

ion implantation

Moderate heating is applied to the carrier or cavity to ensure process stability and doping effect.

Gas flow path/chamber heating

Prevent gas condensation in pipelines or chambers to improve gas transport efficiency and purity.

Wafer heat treatment

Provide thermal cycling for some processes to improve wafer surface structure or stress relief.

AMAT Applied Materials 0010-76136加熱器 產(chǎn)品展示      

 產(chǎn)品視頻

3.其他產(chǎn)品

Horner Electric HE693DAC420D隔離分析輸出模塊
Horner Electric HE693IBS100D通信模塊
Horner Electric HE693RTU900G接口模塊

4.其他英文產(chǎn)品

CP238TA Expansion CARDS
CP238TA1 Expansion CARDS
KOKUSAI CXP-544A KOMS-A2 Main control circuit board

The content is from Ruichang Mingsheng Automation Equipment Co., LTD

Contact: +86 15270269218