AMAT Applied Materials 0190-34229流量控制器

1.產(chǎn) 品 資 料 介 紹：

產(chǎn)品概述

AMAT 0190-34229 流量控制器是 Applied Materials 半導(dǎo)體工藝設(shè)備中用于精確控制氣體流量的關(guān)鍵模塊。它通常用于化學(xué)氣相沉積（CVD）、物理氣相沉積（PVD）、刻蝕（Etch）等工藝中，對(duì)工藝氣體的流量進(jìn)行精準(zhǔn)調(diào)節(jié)，以確保工藝參數(shù)穩(wěn)定和工藝質(zhì)量一致性。

技術(shù)參數(shù)（典型特征）

• 類型：質(zhì)量流量控制器（MFC）

• 功能：精確控制氣體流量，實(shí)現(xiàn)閉環(huán)流量調(diào)節(jié)

• 流量范圍：通常從幾 sccm 到幾千 sccm（具體依工藝需求）

• 精度：高精度流量控制（誤差通常 ±1%~±2% FS）

• 接口類型：數(shù)字或模擬輸入/輸出，可與控制器或 PLC 聯(lián)動(dòng)

• 控制方式：閉環(huán)控制，支持實(shí)時(shí)反饋調(diào)節(jié)

• 工作環(huán)境：潔凈室兼容，耐化學(xué)腐蝕、適應(yīng)半導(dǎo)體工藝條件

• 兼容設(shè)備：Applied Materials 各類沉積、刻蝕及離子注入設(shè)備

應(yīng)用場(chǎng)景

1. 工藝氣體流量控制

   • 精確調(diào)節(jié)反應(yīng)氣體或載氣流量，確保工藝穩(wěn)定性。

2. 半導(dǎo)體沉積與刻蝕工藝

   • 對(duì) CVD、PVD 或 Etch 工藝中的氣體配比和流速進(jìn)行控制，提高薄膜均勻性和重復(fù)性。

3. 工藝參數(shù)監(jiān)控

   • 實(shí)時(shí)采集流量數(shù)據(jù)，反饋至數(shù)字控制器，實(shí)現(xiàn)閉環(huán)調(diào)節(jié)。

4. 設(shè)備維護(hù)與校準(zhǔn)

   • 支持模塊化更換與校準(zhǔn)，減少停機(jī)時(shí)間并保證精度。

AMAT Applied Materials 0190-34229流量控制器 英文資料：

Product Overview

The AMAT 0190-34229 flow controller is a key module used in Applied Materials semiconductor process equipment for precise control of gas flow. It is commonly used in chemical vapor deposition (CVD), physical vapor deposition (PVD), etching (Etch) and other processes to precisely adjust the flow rate of process gases to ensure stable process parameters and consistent process quality.

Technical parameters (typical features)

Type: Mass Flow Controller (MFC)

Function: Accurately control gas flow and achieve closed-loop flow regulation

Flow range: usually from a few sccm to several thousand sccm (depending on process requirements)

Accuracy: High precision flow control (error usually ± 1%~± 2% FS)

Interface type: digital or analog input/output, can be linked with a controller or PLC

Control mode: closed-loop control, supporting real-time feedback adjustment

Work environment: cleanroom compatible, chemically resistant, and adaptable to semiconductor process conditions

Compatible devices: Various deposition, etching, and ion implantation equipment from Applied Materials

Application scenarios

Process gas flow control

Accurately adjust the flow rate of reaction gas or carrier gas to ensure process stability.

Semiconductor deposition and etching processes

Control the gas ratio and flow rate in CVD, PVD, or Etch processes to improve film uniformity and repeatability.

Process parameter monitoring

Real time collection of traffic data, feedback to the digital controller, to achieve closed-loop regulation.

Equipment maintenance and calibration

Support modular replacement and calibration to reduce downtime and ensure accuracy.

AMAT Applied Materials 0190-34229流量控制器  產(chǎn)品展示      

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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