AMAT Applied Materials 0041-10824加熱器

1.產(chǎn) 品 資 料 介 紹：

產(chǎn)品概述

AMAT 0041-10824 加熱器是 Applied Materials 半導(dǎo)體工藝設(shè)備中的關(guān)鍵加熱模塊，主要用于控制工藝腔體或工藝板的溫度。該加熱器在沉積、刻蝕、離子注入等半導(dǎo)體制造工藝中起到核心作用，通過精確的熱能傳遞保證工藝溫度的穩(wěn)定性和均勻性，從而提升產(chǎn)品良率和工藝一致性。

技術(shù)參數(shù)（典型特征）

• 類型：加熱器 / Heater Module

• 功能：提供穩(wěn)定、可控的熱量，用于工藝腔體或工藝板加熱

• 功率范圍：根據(jù)工藝需求設(shè)計（通常幾十瓦到幾百瓦）

• 控制方式：與數(shù)字控制器或溫控模塊配合，實現(xiàn)閉環(huán)溫度控制

• 接口形式：標(biāo)準(zhǔn)電氣接口，與控制系統(tǒng)和加熱器底板配合使用

• 工作環(huán)境：潔凈室兼容，耐高溫、耐化學(xué)腐蝕

• 兼容設(shè)備：Applied Materials CVD、PVD、Etch、Ion Implant 等半導(dǎo)體設(shè)備

應(yīng)用場景

1. 工藝腔體加熱

   • 提供穩(wěn)定溫度環(huán)境，確保薄膜沉積、刻蝕或離子注入過程的精確性。

2. 工藝板/晶圓加熱

   • 對晶圓或工藝板進行均勻加熱，提高工藝一致性和良率。

3. 溫度閉環(huán)控制

   • 與數(shù)字控制器或溫控模塊配合，實時調(diào)節(jié)加熱功率，實現(xiàn)精確溫控。

4. 設(shè)備維護和更換

   • 模塊化設(shè)計便于快速拆裝，提高設(shè)備維護效率。

AMAT Applied Materials 0041-10824加熱器 英文資料：

Product Overview

AMAT 0041-10824 heater is a key heating module in Applied Materials semiconductor process equipment, mainly used to control the temperature of process chambers or process boards. This heater plays a core role in semiconductor manufacturing processes such as deposition, etching, and ion implantation, ensuring the stability and uniformity of process temperature through precise heat transfer, thereby improving product yield and process consistency.

Technical parameters (typical features)

Type: Heater/Heater Module

Function: Provides stable and controllable heat for heating process chambers or process boards

Power range: Designed according to process requirements (usually tens to hundreds of watts)

Control method: Cooperate with digital controller or temperature control module to achieve closed-loop temperature control

Interface form: Standard electrical interface, used in conjunction with the control system and heater base plate

Work environment: cleanroom compatible, high temperature resistant, chemical resistant

Compatible devices: Applied Materials CVD, PVD, Etch, Ion Implant and other semiconductor devices

Application scenarios

Process chamber heating

Provide a stable temperature environment to ensure the accuracy of thin film deposition, etching, or ion implantation processes.

Process board/wafer heating

Uniform heating of wafers or process boards to improve process consistency and yield.

Temperature closed-loop control

Cooperate with digital controllers or temperature control modules to adjust heating power in real-time and achieve precise temperature control.

Equipment maintenance and replacement

Modular design facilitates quick disassembly and assembly, improving equipment maintenance efficiency.

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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