AMAT Applied Materials 0100-02292背板
1.產 品 資 料 介 紹：
技術維度 | 具體參數(shù)與實現(xiàn)細節(jié) |
部件屬性 | 半導體設備專用高密度互聯(lián)背板，適配 AMAT 設備模塊化電氣系統(tǒng)的集成需求 |
安裝定位 | 設備電氣控制柜內部核心區(qū)域，采用導軌式或螺釘固定式安裝，與各功能模塊接口對齊精度≤0.1mm，周邊預留≥20mm 散熱空間 |
核心功能 | 多模塊信號互聯(lián)（支持數(shù)字信號、模擬信號傳輸）、集中式電力分配（為不同模塊提供適配電壓）、模塊連接狀態(tài)監(jiān)測 |
材質體系 | 基板采用 FR-4 玻璃纖維環(huán)氧樹脂（介電常數(shù) 4.0-4.5，介損角正切≤0.02），導電層為電解銅（厚度 35μm-70μm），表面采用沉金工藝處理（金層厚度≥1μm） |
電氣性能 | 信號傳輸速率最高可達 10Gbps，信號衰減≤0.5dB/m（在 1GHz 頻率下）；電力分配支持 5V、12V、24V 多電壓輸出，最大總供電電流 50A，各供電通道紋波≤50mV |
連接接口 | 配備 20 個以上標準連接器（兼容 AMAT 專用接口協(xié)議），接觸電阻≤20mΩ，插拔壽命≥1000 次，具備防誤插設計（采用獨特鍵位布局） |
防護性能 | 絕緣電阻≥1012Ω，耐電壓≥1000V AC（1 分鐘無擊穿），工作溫度范圍 -20℃至 70℃，濕度適應范圍 10%-90%（無凝露） |
- 高精度工藝設備場景：在光刻設備、薄膜沉積設備中，該背板可實現(xiàn)控制模塊與精密電機驅動模塊之間的高速信號傳輸，將信號延遲控制在 10ns 以內，保障電機運動的定位精度（偏差≤0.001mm），滿足晶圓加工的微米級甚至納米級工藝要求。
- 設備高負荷運行場景：在半導體生產線 24 小時連續(xù)運行的環(huán)境下，背板采用多通道并行供電設計，可根據(jù)各模塊負載動態(tài)調整電力分配，避免因單一模塊過載導致的供電故障，同時其優(yōu)異的散熱性能（通過基板導熱與空氣自然對流結合）可使工作溫度穩(wěn)定在 40℃以下，確保長期高負荷運行的可靠性。
- 潔凈室嚴苛環(huán)境場景：背板表面采用無鉛沉金工藝，無污染物析出，可耐受潔凈室中 99% 異丙醇（IPA）的定期清潔，符合 ISO 5 級潔凈室的顆?？刂茦藴剩苛⒎接⒊撸?.5μm 顆粒＜100 個），避免因部件污染影響晶圓生產質量。
AMAT Applied Materials 0100-02292背板 英文資料：
1、 Product positioning and core values
The AMAT 0100-02292 backplane is a key interconnect component in Applied Materials semiconductor equipment, mainly responsible for signal transmission and power distribution tasks between various functional modules (such as control modules, drive modules, and detection modules) inside the equipment. In the complex electrical system of semiconductor equipment, it is like a "neural network backbone", which not only needs to ensure the high-speed and stable data transmission between multiple modules, but also to achieve precise power distribution, providing reliable hardware support for the coordinated operation of various components of the equipment. It is an important basic component to ensure the high-precision and high-efficiency operation of semiconductor equipment.
2、 Core technical characteristics and process specifications
Technical dimension
Specific parameters and implementation details
Component Attributes
High density interconnect backplane for semiconductor equipment, adapted to the integration requirements of modular electrical systems in AMAT devices
Installation and positioning
The core area inside the electrical control cabinet of the equipment is installed using guide rail or screw fixation, with an alignment accuracy of ≤ 0.1mm with each functional module interface, and a reserved heat dissipation space of ≥ 20mm around the perimeter
Core functions
Multi module signal interconnection (supporting digital and analog signal transmission), centralized power distribution (providing adaptive voltage for different modules), module connection status monitoring
Material system
The substrate is made of FR-4 glass fiber epoxy resin (dielectric constant 4.0-4.5, dielectric loss tangent ≤ 0.02), the conductive layer is electrolytic copper (thickness 35 μ m-70 μ m), and the surface is treated with gold deposition process (gold layer thickness ≥ 1 μ m)
Electrical performance
The maximum signal transmission rate can reach 10Gbps, and the signal attenuation is ≤ 0.5dB/m (at 1GHz frequency); Power distribution supports multiple voltage outputs of 5V, 12V, and 24V, with a maximum total supply current of 50A and ripple ≤ 50mV in each supply channel
Connection interface
Equipped with more than 20 standard connectors (compatible with AMAT dedicated interface protocol), contact resistance ≤ 20m Ω, plug and unplug life ≥ 1000 times, with anti misoperation design (using unique key layout)
Protective performance
Insulation resistance ≥ 10 12 Ω, withstand voltage ≥ 1000V AC (no breakdown for 1 minute), operating temperature range -20 ℃ to 70 ℃, humidity adaptation range 10% -90% (no condensation)
3、 Scene adaptation and performance advantages
1. Adaptation to Semiconductor Core Scenarios
High precision process equipment scenario: In lithography equipment and thin film deposition equipment, this backplane can achieve high-speed signal transmission between the control module and the precision motor drive module, controlling the signal delay within 10ns, ensuring the positioning accuracy of the motor movement (deviation ≤ 0.001mm), and meeting the micro - or even nano level process requirements of wafer processing.
AMAT Applied Materials 0100-02292背板 產品展示
產品視頻
3.其他產品
Kongsberg 6200455 控制器模塊
ABB RTU560?560CMD11 通信單元
EKF ETH4 CN4-BELL 以太網(wǎng)控制器
4.其他英文產品
216VC62a HESG324442R13/E HESG324442R112/F Excitation module
216NG62A HESG441634R1/K HESG216876 Excitation module
8610-FT-NA Industrial gas turbine module
| 6ES5951-7ND12 | 02-032374-00 | EPC-7AM |
| 6ES5951-7LB21 | 531X121PCRAHG1 | 879-8103-001A |
| 6ES5948-3UR23 | 01-17423-003 | EXM-15A |
| 6ES5948-3UR11 | 6SC6100-0SA11 | 0660-01857 |
| 6ES5948-3UA12 | 6SC6103-0SE30 | C52711-022 |
| 6ES5945-7UA21 | 6SC6500-ONA04 | CE945GM2B-440 |
| 6ES5943-7UB21 | 6SC6110-0EA00 | exm-10a |
| 6ES5942-7UB11 | 6SC6114-5DA00 | 61-0654-22 |
The content is from Ruichang Mingsheng Automation Equipment Co., LTD
Contact: +86 15270269218
