AMAT 3930-00092 控制器

1.產(chǎn) 品 資 料 介 紹：

AMAT 3930-00092 控制器

產(chǎn)品概述

AMAT（Applied Materials）3930-00092 控制器是一種用于半導(dǎo)體制造設(shè)備的 核心電子控制單元。它用于協(xié)調(diào)設(shè)備內(nèi)部各子模塊的運(yùn)行，包括加熱器、泵浦、氣動(dòng)閥門、射頻模塊、傳感器等，實(shí)現(xiàn)工藝參數(shù)精確控制和設(shè)備狀態(tài)實(shí)時(shí)監(jiān)控。該控制器通常安裝于控制箱或底盤中，是設(shè)備自動(dòng)化運(yùn)行和工藝穩(wěn)定的關(guān)鍵模塊。

技術(shù)參數(shù)（典型方向，具體數(shù)據(jù)需參考原廠資料）

• 處理能力：支持多路模塊并行控制

• 接口類型：數(shù)字/模擬輸入輸出接口，兼容 AMAT 各類子模塊

• 通信能力：支持與上位控制系統(tǒng)及互鎖模塊的數(shù)據(jù)通信

• 控制功能：邏輯運(yùn)算、工藝調(diào)節(jié)、狀態(tài)監(jiān)控

• 安裝方式：模塊化設(shè)計(jì)，可集成于控制箱或底盤

• 環(huán)境適應(yīng)性：適應(yīng)半導(dǎo)體設(shè)備潔凈室及工業(yè)溫度環(huán)境

應(yīng)用場(chǎng)景

1. 沉積工藝（CVD/PVD/ALD）

   • 控制加熱器溫度、氣體流量和泵浦壓力

   • 保證薄膜沉積均勻性和工藝重復(fù)性

2. 刻蝕工藝設(shè)備

   • 控制射頻功率模塊、刻蝕氣體流量及腔體壓力

   • 提高刻蝕精度和工藝穩(wěn)定性

3. 離子注入系統(tǒng)

   • 控制離子源、掃描系統(tǒng)及束流監(jiān)測(cè)模塊

   • 確保注入劑量和均勻性

4. 控制箱與底盤控制箱

   • 作為設(shè)備內(nèi)部各模塊的核心控制單元

   • 與電源模塊、互鎖模塊、PCB等配合，實(shí)現(xiàn)設(shè)備安全可靠運(yùn)行

5. 工廠自動(dòng)化與遠(yuǎn)程監(jiān)控

   • 與上位系統(tǒng)和互鎖系統(tǒng)聯(lián)動(dòng)，實(shí)現(xiàn)設(shè)備狀態(tài)監(jiān)控、數(shù)據(jù)采集和異常報(bào)警

AMAT 3930-00092 控制器  英文資料：

AMAT 3930-00092 Controller

Product Overview

The AMAT (Applied Materials) 3930-00092 controller is a core electronic control unit used in semiconductor manufacturing equipment. It is used to coordinate the operation of various sub modules within the equipment, including heaters, pumps, pneumatic valves, RF modules, sensors, etc., to achieve precise control of process parameters and real-time monitoring of equipment status. This controller is usually installed in the control box or chassis and is a key module for equipment automation operation and process stability.

Technical parameters (typical direction, specific data should refer to the original factory information)

Processing capability: Supports parallel control of multiple modules

Interface type: digital/analog input/output interface, compatible with various sub modules of AMAT

Communication capability: Supports data communication with the upper control system and interlock module

Control functions: logic operation, process adjustment, status monitoring

Installation method: Modular design, can be integrated into the control box or chassis

Environmental adaptability: Suitable for semiconductor equipment cleanrooms and industrial temperature environments

Application scenarios

Deposition process (CVD/PVD/ALD)

Control heater temperature, gas flow rate, and pump pressure

Ensure the uniformity of thin film deposition and process repeatability

Etching process equipment

Control RF power module, etching gas flow rate, and chamber pressure

Improve etching accuracy and process stability

Ion implantation system

Control ion source, scanning system, and beam monitoring module

Ensure injection dose and uniformity

Control box and chassis control box

As the core control unit of each module inside the device

Cooperate with power modules, interlock modules, PCBs, etc. to achieve safe and reliable operation of equipment

Factory Automation and Remote Monitoring

Linkage with the upper system and interlocking system to achieve equipment status monitoring, data collection, and abnormal alarm

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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