AMAT  0050-37127氣門桿

1.產(chǎn) 品 資 料 介 紹：

AMAT 0050-37127 氣門桿

產(chǎn)品概述

AMAT（Applied Materials）0050-37127 氣門桿是半導(dǎo)體工藝設(shè)備中氣體輸送與真空控制系統(tǒng)的關(guān)鍵機(jī)械部件之一，通常作為閥門組件的核心執(zhí)行元件，起到閥門開閉、密封和流量調(diào)節(jié)的作用。其質(zhì)量與精度直接影響氣體控制的穩(wěn)定性和工藝的均勻性。

技術(shù)參數(shù)（典型方向，具體數(shù)據(jù)需參考原廠資料）

• 材質(zhì)：高強(qiáng)度不銹鋼或合金材料，具備耐腐蝕與高真空適應(yīng)性

• 表面處理：精密加工與光潔度處理，減少摩擦和顆粒產(chǎn)生

• 適用環(huán)境：高真空、超凈室工藝環(huán)境

• 精度：高同軸度與耐磨性，保證閥門啟閉的重復(fù)性

• 兼容性：適配 AMAT 多種工藝氣體控制閥門

應(yīng)用場景

1. 半導(dǎo)體氣體輸送系統(tǒng)

   • 安裝在氣體閥門中，用于控制氮?dú)?、氬氣、氟化物、硅烷等高純工藝氣體的輸送。

   • 確保流量穩(wěn)定、反應(yīng)氣氛一致。

2. 真空腔體控制

   • 用于真空閥門，實(shí)現(xiàn)腔體抽真空、充氣過程的啟閉切換。

   • 保障腔體環(huán)境的快速穩(wěn)定。

3. 沉積工藝（CVD/PVD/ALD）

   • 通過閥門啟閉控制氣體反應(yīng)源的供給，確保薄膜沉積均勻性和膜層質(zhì)量。

4. 刻蝕工藝

   • 調(diào)控反應(yīng)性氣體流量，保證刻蝕速率和形貌控制。

5. 離子注入與清洗工藝

   • 控制腔體內(nèi)輔助氣體（如氮?dú)?、氧氣）的穩(wěn)定供給。

6. 設(shè)備維護(hù)與替換

   • 作為易損件之一，在設(shè)備長期運(yùn)行中需定期更換，以維持氣體控制的精確性。

AMAT 0050-37127氣門桿  英文資料：

AMAT 0050-37127 Valve Stem

Product Overview

AMAT (Applied Materials) 0050-37127 valve stem is one of the key mechanical components of gas delivery and vacuum control systems in semiconductor process equipment. It is usually used as the core actuator of valve components, playing a role in valve opening and closing, sealing, and flow regulation. Its quality and accuracy directly affect the stability of gas control and the uniformity of the process.

Technical parameters (typical direction, specific data should refer to the original factory information)

Material: High strength stainless steel or alloy material, with corrosion resistance and high vacuum adaptability

Surface treatment: precision machining and smoothness treatment to reduce friction and particle generation

Applicable environment: high vacuum, ultra clean room process environment

Accuracy: High coaxiality and wear resistance, ensuring the repeatability of valve opening and closing

Compatibility: Compatible with various AMAT process gas control valves

Application scenarios

Semiconductor gas delivery system

Installed in gas valves, it is used to control the transportation of high-purity process gases such as nitrogen, argon, fluoride, silane, etc.

Ensure stable flow and consistent reaction atmosphere.

Vacuum chamber control

Used for vacuum valves to switch the opening and closing of the chamber during vacuum pumping and inflation processes.

Ensure the rapid stability of the cavity environment.

Deposition process (CVD/PVD/ALD)

Control the supply of gas reaction source through valve opening and closing to ensure the uniformity of film deposition and film quality.

etching process

Regulate the flow rate of reactive gases to ensure etching rate and morphology control.

Ion implantation and cleaning process

Control the stable supply of auxiliary gases (such as nitrogen and oxygen) inside the control chamber.

Equipment maintenance and replacement

As one of the vulnerable parts, the equipment needs to be replaced regularly during long-term operation to maintain the accuracy of gas control.

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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