Tokyo Electron TEB207-12 OGSI EC80-000157-12 電子模塊組件
1.產(chǎn) 品 資 料 介 紹:
中文資料:
關(guān)于 Tokyo Electron(東京電子)TEB207-12 OGSI EC80-000157-12 電子模塊組件,以下是目前可整理的核心信息:
型號說明:
制造商:Tokyo Electron Ltd.(TEL)
型號 1:TEB207-12
型號 2 / 內(nèi)部編號:OGSI EC80-000157-12
類型:電子模塊組件 / 電路控制組件
應(yīng)用平臺:通常應(yīng)用于 TEL 半導(dǎo)體設(shè)備,如 真空蝕刻機、CVD 系統(tǒng)、PVD 系統(tǒng)、清洗設(shè)備 等。
功能定位(依據(jù)命名結(jié)構(gòu)及行業(yè)經(jīng)驗):
該模塊可能是以下幾種功能之一:
電源控制模塊(Power Supply/Regulation Unit)
IO 接口控制模塊(I/O Interface Board)
信號調(diào)節(jié)或驅(qū)動模塊(Signal Conditioning/Driver Board)
工藝控制子系統(tǒng)中的 PCB 模塊
由于東京電子的產(chǎn)品通常為 專用定制模塊(custom modules),很多編號如 “EC80-xxxxx” 屬于 OGSI 或 TEL 內(nèi)部控制件編號,外界資料較少公開。
應(yīng)用場景(推測):
設(shè)備型號:TEL Unity、Trias、Nexx、Trias SPA、Eagle 等系列的蝕刻/沉積設(shè)備
作用:模塊可能參與以下子系統(tǒng)工作:
等離子源控制
腔體真空狀態(tài)檢測/調(diào)節(jié)
RF 匹配器調(diào)節(jié)
溫控或流量監(jiān)控子系統(tǒng)
英文資料:
Regarding the electronic module components of Tokyo Electron TEB207-12 OGSI EC80-0000157-12, the following is currently the core information that can be organized:
Model Description:
manufacturer: Tokyo Electron Ltd.(TEL)
Model 1: TEB207-12
Model 2/Internal Number: OGSI EC80-000157-12
Type: Electronic Module Component/Circuit Control Component
Application Platform: Typically used in TEL semiconductor equipment, such as vacuum etching machines, CVD systems, PVD systems, cleaning equipment, etc.
Functional positioning (based on naming structure and industry experience):
This module may have one of the following functions:
Power Supply/Regulation Unit
I/O Interface Board
Signal Conditioning/Driver Board
PCB module in the process control subsystem
Due to the fact that Tokyo Electronics' products are usually customized modules, many codes such as "EC80-xxxxx" belong to OGSI or TEL internal control part codes, and external information is less publicly available.
Application scenario (speculation):
Equipment models: TEL Unity, Trias, Nexx, Trias SPA, Eagle and other series of etching/deposition equipment
Function: The module may participate in the work of the following subsystems:
Plasma source control
Vacuum state detection/adjustment of the cavity
RF Matcher Adjustment
Temperature control or flow monitoring subsystem
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