LAM 853-227247-001機器人套裝

1.產 品 資 料 介 紹：

中文資料：

LAM 853-227247-001 機器人套裝 主要用于 半導體制造 領域，特別是在 晶圓加工 過程中，實現 精確、高效的自動化晶圓傳輸。它是 Lam Research 設備中的重要組件，適用于 前道（Front-End）和后道（Back-End）工藝，確保生產過程的高精度和高可靠性。

 產品應用領域

 半導體制造（晶圓處理）

• 光刻（Lithography）：在光刻工藝中，需將晶圓精準送入光刻機并取出，確保對準和無損傳輸。
• 刻蝕（Etching）：用于等離子刻蝕（如 Lam Research 9400, TCP 9600, Versys 等設備），精準傳輸晶圓，避免顆粒污染。
• 沉積（Deposition）：適用于 化學氣相沉積（CVD）、原子層沉積（ALD）、物理氣相沉積（PVD） 設備，確保均勻處理。
• 離子注入（Ion Implantation）：將晶圓從傳輸系統(tǒng)送入離子注入機，確保精準對準，提高工藝控制能力。
• 清洗（Cleaning）：配合清洗設備（如 SPTS Omega 系列），安全處理超薄晶圓，防止破損。

 面板顯示（FPD，Flat Panel Display）

• 適用于 OLED、LCD、MicroLED 面板制造，保證大尺寸玻璃基板的精準傳輸，防止劃痕和微塵污染。

 先進封裝（Advanced Packaging）

• 在 2.5D、3D IC 封裝 過程中，用于晶圓級封裝（WLP）、倒裝芯片（Flip-Chip）等生產線的自動化搬運。

 其他高精度自動化

• 光通信、MEMS、功率半導體制造：支持高精度芯片傳輸，適用于 SiC、GaN 等材料的特殊工藝。
• 實驗室自動化：用于科研設備，提供精確的樣品搬運方案。

英文資料：

The LAM 853-227247-001 robot kit is mainly used in the semiconductor manufacturing field, especially in wafer processing, to achieve precise and efficient automated wafer transfer. It is an important component in Lam Research equipment, suitable for both Front End and Back End processes, ensuring high precision and reliability in the production process.

Product application areas

Semiconductor Manufacturing (Wafer Processing)

Lithography: In the photolithography process, the wafer needs to be accurately fed into the lithography machine and removed to ensure alignment and lossless transmission.

Etching: Used for plasma etching (such as Lam Research 9400, TCP 9600, Versys, etc.) to accurately transport wafers and avoid particle contamination.

Deposition: Suitable for chemical vapor deposition (CVD), atomic layer deposition (ALD), and physical vapor deposition (PVD) equipment to ensure uniform processing.

Ion implantation: Sending wafers from a transport system into an ion implantation machine to ensure precise alignment and improve process control capabilities.

Cleaning: Cooperate with cleaning equipment (such as SPTS Omega series) to safely handle ultra-thin wafers and prevent damage.

Flat Panel Display (FPD)

Suitable for manufacturing OLED, LCD, and MicroLED panels, ensuring precise transmission of large-sized glass substrates and preventing scratches and dust pollution.

Advanced Packaging

Used for automated handling of wafer level packaging (WLP), flip chip, and other production lines in 2.5D and 3D IC packaging processes.

Other high-precision automation

Optical communication MEMS、 Power semiconductor manufacturing: supports high-precision chip transmission and is suitable for special processes of materials such as SiC and GaN.

Laboratory automation: used for scientific research equipment, providing precise sample handling solutions.

2.產      品      展      示      

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