AMAT  0100-38027探測器板組件

1.產(chǎn) 品 資 料 介 紹：

AMAT 0100-38027 探測器板組件

產(chǎn)品概述

AMAT（Applied Materials）0100-38027 探測器板組件是一種安裝在半導(dǎo)體制造設(shè)備中的電子功能模塊，主要用于信號檢測、工藝監(jiān)控和數(shù)據(jù)采集。它通常作為探測器與主控制系統(tǒng)之間的接口電路，負(fù)責(zé)接收、放大、濾波和處理來自傳感器或探頭的信號，以便實現(xiàn)對工藝環(huán)境和運(yùn)行狀態(tài)的實時監(jiān)控。該組件在沉積、刻蝕、離子注入等工藝中都可能作為關(guān)鍵監(jiān)測環(huán)節(jié)。

技術(shù)參數(shù)（典型方向，具體參數(shù)需參考原廠資料）

• 電路結(jié)構(gòu)：多層印刷電路板，集成探測電路與信號處理模塊

• 信號類型：支持模擬與數(shù)字信號輸入，具備高速采樣能力

• 功能特性：信號放大、噪聲抑制、數(shù)據(jù)轉(zhuǎn)換與傳輸

• 工作環(huán)境：適應(yīng)半導(dǎo)體設(shè)備高真空、低顆粒及高潔凈度環(huán)境

• 接口：兼容 AMAT 設(shè)備主控制器和上位機(jī)系統(tǒng)

應(yīng)用場景

1. 薄膜沉積工藝（CVD/PVD/ALD）

   • 檢測沉積過程中反應(yīng)氣體或腔體環(huán)境變化，輔助閉環(huán)控制。

   • 采集等離子體發(fā)光或反射信號，用于膜厚監(jiān)控。

2. 刻蝕工藝

   • 監(jiān)控等離子體狀態(tài)、發(fā)射光譜或反應(yīng)副產(chǎn)物信號。

   • 幫助實現(xiàn)刻蝕終點檢測（End Point Detection, EPD）。

3. 離子注入系統(tǒng)

   • 檢測離子束流強(qiáng)度或分布，保證注入劑量和均勻性。

4. 真空腔體狀態(tài)檢測

   • 與傳感器配合，實時監(jiān)控腔體內(nèi)壓力、氣體流量和溫度信號。

5. 工廠自動化與安全

   • 作為工藝檢測與報警觸發(fā)的前端電路，保障工藝穩(wěn)定與設(shè)備安全。

AMAT 0100-38027探測器板組件 英文資料：

AMAT 0100-38027 Detector Board Component

Product Overview

AMAT (Applied Materials) 0100-38027 detector board assembly is an electronic functional module installed in semiconductor manufacturing equipment, mainly used for signal detection, process monitoring, and data acquisition. It usually serves as an interface circuit between the detector and the main control system, responsible for receiving, amplifying, filtering, and processing signals from sensors or probes to achieve real-time monitoring of the process environment and operating status. This component may serve as a key monitoring link in processes such as deposition, etching, and ion implantation.

Technical parameters (typical direction, specific parameters need to refer to the original factory information)

Circuit structure: multi-layer printed circuit board, integrated detection circuit and signal processing module

Signal type: Supports analog and digital signal input, with high-speed sampling capability

Functional features: signal amplification, noise suppression, data conversion and transmission

Work environment: Suitable for high vacuum, low particle, and high cleanliness environments of semiconductor equipment

Interface: Compatible with AMAT device main controller and upper computer system

Application scenarios

Thin film deposition process (CVD/PVD/ALD)

Detecting changes in reaction gases or chamber environment during the sedimentation process to assist in closed-loop control.

Collect plasma luminescence or reflection signals for film thickness monitoring.

etching process

Monitor plasma state, emission spectra, or reaction byproduct signals.

Assist in achieving End Point Detection (EPD) for etching.

Ion implantation system

Detect ion beam intensity or distribution to ensure injection dose and uniformity.

Vacuum chamber status detection

Cooperate with sensors to monitor real-time pressure, gas flow rate, and temperature signals inside the chamber.

Factory Automation and Safety

As a front-end circuit for process detection and alarm triggering, it ensures process stability and equipment safety.

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The content is from Ruichang Mingsheng Automation Equipment Co., LTD

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