AMAT Applied Materials 0040-20100-01加熱器底板

1.產(chǎn) 品 資 料 介 紹：

產(chǎn)品概述

AMAT 0040-20100-01 加熱器底板是 Applied Materials 半導(dǎo)體工藝設(shè)備中的關(guān)鍵支撐與散熱組件。它通常用于加熱器模塊的安裝與固定，同時提供穩(wěn)定的熱傳導(dǎo)和電氣隔離。該底板確保加熱器在工藝腔體或相關(guān)裝置中能安全、均勻地傳遞熱量，從而保證沉積、刻蝕或擴(kuò)散工藝的溫度精度和一致性。

技術(shù)參數(shù)（推斷與行業(yè)常規(guī)）

• 類型：加熱器底板（Heater Base Plate / Mounting Plate）

• 功能：機(jī)械支撐、熱傳導(dǎo)、電子隔離

• 材質(zhì)：高溫耐腐蝕金屬或陶瓷復(fù)合材料

• 尺寸與安裝：根據(jù)設(shè)備型號設(shè)計，適配特定加熱器模塊

• 耐溫性能：可承受加熱器工作溫度范圍，保證穩(wěn)定性

• 工作環(huán)境：半導(dǎo)體潔凈室，耐真空或低壓環(huán)境

• 兼容設(shè)備：Applied Materials 多類沉積、刻蝕或熱處理設(shè)備

應(yīng)用場景

1. 加熱器模塊支撐

   • 固定加熱器組件，保證其在工藝腔體中的位置穩(wěn)定。

2. 熱量傳導(dǎo)與均勻化

   • 通過底板實現(xiàn)均勻熱分布，減少局部過熱或冷點，提高工藝一致性。

3. 電氣隔離與安全

   • 隔離加熱器電氣部件，保障設(shè)備及晶圓安全。

4. 設(shè)備維護(hù)與更換

   • 便于拆裝加熱器模塊，提高維護(hù)效率，減少停機(jī)時間。

AMAT Applied Materials 0040-20100-01加熱器底板 英文資料：

Product Overview

The AMAT 0040-2010000-01 heater base plate is a key support and heat dissipation component in Applied Materials semiconductor process equipment. It is commonly used for the installation and fixation of heater modules, while providing stable heat conduction and electrical isolation. The bottom plate ensures that the heater can safely and uniformly transfer heat in the process chamber or related devices, thereby ensuring the temperature accuracy and consistency of deposition, etching, or diffusion processes.

Technical parameters (inference and industry norms)

Type: Heater Base Plate/Mounting Plate

Function: Mechanical support, thermal conduction, electronic isolation

Material: High temperature corrosion-resistant metal or ceramic composite material

Size and Installation: Designed according to the device model, compatible with specific heater modules

Temperature resistance performance: able to withstand the working temperature range of the heater, ensuring stability

Working environment: semiconductor clean room, resistant to vacuum or low pressure environment

Compatible devices: Applied Materials multi class deposition, etching, or heat treatment equipment

Application scenarios

Heater module support

Fix the heater component to ensure its stable position in the process chamber.

Heat conduction and homogenization

Realize uniform heat distribution through the bottom plate, reduce local overheating or cold spots, and improve process consistency.

Electrical isolation and safety

Isolate the electrical components of the heater to ensure equipment and wafer safety.

Equipment maintenance and replacement

Easy to disassemble and assemble heater modules, improve maintenance efficiency, and reduce downtime.

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