Alcatel Lucent 3BA23260AAAB光學(xué)電氣板
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Alcatel-Lucent 3BA23260AAAB 是一款高性能的光學(xué)電氣轉(zhuǎn)換板，廣泛應(yīng)用于 光通信網(wǎng)絡(luò)、數(shù)據(jù)中心、光傳輸系統(tǒng)（OTN）、SDH/SONET 傳輸設(shè)備 以及 無(wú)線通信基站。該模塊負(fù)責(zé)光信號(hào)與電信號(hào)的高效轉(zhuǎn)換，確保數(shù)據(jù)的高速、穩(wěn)定傳輸。
產(chǎn)品特點(diǎn)：
1. 光電轉(zhuǎn)換功能
具備 光信號(hào) → 電信號(hào)（O/E） 和 電信號(hào) → 光信號(hào)（E/O） 轉(zhuǎn)換能力，實(shí)現(xiàn)光纖通信與電信號(hào)網(wǎng)絡(luò)的無(wú)縫連接。
適用于 SDH/SONET、OTN、DWDM、CWDM 等光傳輸系統(tǒng)，支持多波長(zhǎng)信號(hào)傳輸。
2. 高速數(shù)據(jù)傳輸
支持 高達(dá) 10Gbps 或更高的傳輸速率，滿足現(xiàn)代通信網(wǎng)絡(luò)的高帶寬需求。
低延遲、高吞吐量，確保 光纖信號(hào)的穩(wěn)定傳輸，適用于 核心網(wǎng)和骨干網(wǎng)。
3. 多接口兼容性
兼容 SFP+/QSFP+ 光模塊，可靈活支持 單模/多模光纖，適用于不同應(yīng)用場(chǎng)景。
提供 以太網(wǎng)（10G/25G/40G）、SDH（STM-64）、OTN（OTU2/OTU3） 接口，確保廣泛的網(wǎng)絡(luò)兼容性。
4. 高可靠性與穩(wěn)定性
采用 工業(yè)級(jí) PCB 材料，具備 抗干擾、耐高溫、耐濕度 特性，可在復(fù)雜環(huán)境下長(zhǎng)期穩(wěn)定運(yùn)行。
具備 過(guò)流、過(guò)壓、溫度監(jiān)測(cè) 保護(hù)機(jī)制，提高設(shè)備安全性。
5. 低功耗優(yōu)化設(shè)計(jì)
采用 節(jié)能芯片 和 智能電源管理技術(shù)，降低功耗，減少運(yùn)行成本。
適用于 數(shù)據(jù)中心和運(yùn)營(yíng)商網(wǎng)絡(luò)，優(yōu)化能源消耗。
英文資料：
Alcatel Lucent 3BA23260AAB is a high-performance optical electrical conversion board widely used in optical communication networks, data centers, optical transmission systems (OTN), SDH/SONET transmission equipment, and wireless communication base stations. This module is responsible for the efficient conversion of optical signals and electrical signals, ensuring high-speed and stable data transmission.
Product features:
1. Photoelectric conversion function
Capable of converting optical signals to electrical signals (O/E) and electrical signals to optical signals (E/O), achieving seamless connection between fiber optic communication and electrical signal networks.
Suitable for optical transmission systems such as SDH/SONET, OTN, DWDM, CWDM, etc., supporting multi wavelength signal transmission.
2. High speed data transmission
Supports transmission rates of up to 10Gbps or higher, meeting the high bandwidth requirements of modern communication networks.
Low latency and high throughput ensure stable transmission of fiber optic signals, suitable for core and backbone networks.
3. Multi interface compatibility
Compatible with SFP+/QSFP+optical modules, it can flexibly support single-mode/multi-mode fibers and is suitable for different application scenarios.
Provide Ethernet (10G/25G/40G), SDH (STM-64), and OTN (OTU2/OTU3) interfaces to ensure wide network compatibility.
4. High reliability and stability
Using industrial grade PCB materials, it has anti-interference, high temperature resistance, and humidity resistance characteristics, and can operate stably for a long time in complex environments.
Equipped with overcurrent, overvoltage, and temperature monitoring protection mechanisms to improve equipment safety.
5. Low power optimization design
Adopting energy-saving chips and intelligent power management technology to reduce power consumption and lower operating costs.
Suitable for data centers and operator networks, optimizing energy consumption.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
4.其他英文產(chǎn)品
RADISYS 451558-004 Communication Module
| DS200DCFBG1B | CACR-PR30BC3CSY112 | EXM-17 |
| DS200DCFBG1A | CACR-15-FK1KSY2 | 060-03644-0000 |
| DS200DCFBG1A | CACR-U1R010101FD | 44308902 |
| DO3201-A-V001 | GESPAC 22-0075-008 | 330878-90-00 |
| DI3201-A-V001 | GESPAC GESBUS-8M | 3500/22 146031-01 |
| DBC-1 | ,CACR-UP50AABY45 | CE945GM2A-T25 |
| CU834-002 | AMAT 0100-90243 | GKWE001450R0009 XT382B-R9 |
