MKS AX7710SM-01遠程等離子源

1.產(chǎn) 品 資 料 介 紹：

中文資料：

MKS AX7710SM-01 是一款遠程等離子源（Remote Plasma Source, RPS），主要用于半導體制造、平板顯示制造和其他高精度工業(yè)領域。以下是其主要應用領域和特點：

主要應用領域

1. 半導體制造

   • 用于晶圓清洗、刻蝕和薄膜沉積工藝，去除光刻膠和殘留物。

   • 在先進封裝技術中，用于表面處理和清潔。

2. 平板顯示制造

   • 用于 LCD 和 OLED 面板制造中的清洗和表面處理，提高顯示質量。

   • 在薄膜晶體管（TFT）制造中，用于刻蝕和沉積工藝。

3. 太陽能電池制造

   • 用于硅片清洗和表面處理，提高太陽能電池效率。

   • 在薄膜太陽能電池制造中，用于刻蝕和沉積工藝。

4. 光學器件制造

   • 用于鏡頭、棱鏡等光學元件的清洗和表面處理，提高光學性能。

5. 科研與實驗室

   • 用于材料表面改性、薄膜沉積和等離子體研究。

產(chǎn)品特點

• 高效清洗：通過遠程等離子技術，實現(xiàn)高效、均勻的表面清洗。

• 低損傷：減少對敏感材料的損傷，適合高精度工藝。

• 靈活配置：可適配多種氣體（如 O?、H?、N?、CF? 等），滿足不同工藝需求。

• 高穩(wěn)定性：采用先進的控制技術，確保長時間穩(wěn)定運行。

• 易于集成：模塊化設計，便于集成到現(xiàn)有設備中。

• 低維護：設計簡潔，維護成本低。

英文資料：

MKS AX7710SM-01 is a Remote Plasma Source (RPS) primarily used in semiconductor manufacturing, flat panel display manufacturing, and other high-precision industrial fields. The following are its main application areas and characteristics:

Main application areas

Semiconductor Manufacturing

Used for wafer cleaning, etching, and thin film deposition processes to remove photoresist and residues.

In advanced packaging technology, it is used for surface treatment and cleaning.

Flat panel display manufacturing

Used for cleaning and surface treatment in LCD and OLED panel manufacturing to improve display quality.

Used for etching and deposition processes in thin film transistor (TFT) manufacturing.

Manufacturing of solar cells

Used for silicon wafer cleaning and surface treatment to improve the efficiency of solar cells.

In the manufacturing of thin-film solar cells, it is used for etching and deposition processes.

Optical device manufacturing

Used for cleaning and surface treatment of optical components such as lenses and prisms to improve optical performance.

Research and Laboratory

Used for material surface modification, thin film deposition, and plasma research.

Product Features

Efficient cleaning: Through remote plasma technology, efficient and uniform surface cleaning is achieved.

Low damage: reduces damage to sensitive materials and is suitable for high-precision processes.

Flexible configuration: can adapt to multiple gases (such as O ?, H ?, N ?, CF ?, etc.) to meet different process requirements.

High stability: Advanced control technology is adopted to ensure long-term stable operation.

Easy to integrate: Modular design makes it easy to integrate into existing devices.

Low maintenance: The design is simple and the maintenance cost is low.

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