Radisys P1366BX-SVE工業(yè)模塊 是一款專為工業(yè)應(yīng)用設(shè)計的計算機板卡，提供高性能的計算能力和可靠性。

Radisys P1366BX-SVE工業(yè)模塊 詳情介紹：

Radisys的P1366BX-SVE工業(yè)模塊是一款用于高性能計算和通信應(yīng)用的嵌入式模塊。以下是該模塊的主要特點和規(guī)格：

主要特點：

1. 處理器支持：P1366BX-SVE支持基于Intel的處理器架構(gòu)，通常采用高性能的Intel Xeon處理器或類似的工業(yè)級處理器，以滿足高計算能力和多線程處理的需求。
2. 內(nèi)存容量：支持大容量的內(nèi)存配置，通常為DDR3或DDR4 RAM，滿足高帶寬和高存儲需求的應(yīng)用。
3. 存儲選項：通常提供多種存儲選項，包括SATA、SAS接口，支持SSD或HDD存儲設(shè)備。
4. 擴展插槽：包含多個PCIe插槽，用于擴展和連接其他外部設(shè)備或模塊。
5. 網(wǎng)絡(luò)接口：提供多個網(wǎng)絡(luò)接口，包括高速以太網(wǎng)接口，支持高數(shù)據(jù)傳輸速率和低延遲通信。
6. I/O接口：包括多種輸入輸出接口，如USB、串口（RS-232/RS-422/RS-485）、GPIO等，支持各種外部設(shè)備和系統(tǒng)集成。
7. 散熱設(shè)計：工業(yè)級設(shè)計通常包括有效的散熱解決方案，以確保模塊在惡劣環(huán)境下穩(wěn)定運行。
8. 尺寸和形狀：模塊的尺寸通常符合標準的工業(yè)機架或嵌入式系統(tǒng)規(guī)格，便于集成到各種機箱和系統(tǒng)中。

應(yīng)用領(lǐng)域：

• 通信設(shè)備：用于電信基站、路由器和交換機等設(shè)備，支持高吞吐量和低延遲的網(wǎng)絡(luò)通信。
• 工業(yè)控制：在工業(yè)自動化和控制系統(tǒng)中應(yīng)用，用于實時數(shù)據(jù)處理和控制。
• 醫(yī)療設(shè)備：在醫(yī)療影像和數(shù)據(jù)處理設(shè)備中使用，提供高性能計算能力。
• 軍事和國防：適用于要求嚴格的環(huán)境和性能標準的軍事和國防應(yīng)用。

Radisys P1366BX-SVE工業(yè)模塊 實物圖片：

english introduction:

Radisys' P1366BX-SVE industrial module is an embedded module designed for high-performance computing and communication applications. The following are the main features and specifications of this module:

Main features:

Processor support: P1366BX-SVE supports Intel based processor architecture, typically using high-performance Intel Xeon processors or similar industrial grade processors to meet the needs of high computing power and multi-threaded processing.

Memory capacity: Supports high-capacity memory configurations, typically DDR3 or DDR4 RAM, to meet applications with high bandwidth and storage requirements.

Storage options: Multiple storage options are typically provided, including SATA, SAS interfaces, and support for SSD or HDD storage devices.

Expansion Slot: Contains multiple PCIe slots for expanding and connecting other external devices or modules.

Network interface: Provides multiple network interfaces, including high-speed Ethernet interface, supporting high data transmission rate and low latency communication.

I/O interface: including various input and output interfaces, such as USB, serial port (RS-232/RS-422/RS-485), GPIO, etc., supporting various external devices and system integration.

Heat dissipation design: Industrial grade design typically includes effective heat dissipation solutions to ensure stable operation of modules in harsh environments.

Size and shape: The size of the module usually conforms to standard industrial rack or embedded system specifications, making it easy to integrate into various chassis and systems.

Application areas:

Communication equipment: used for telecommunications base stations, routers, switches and other devices, supporting high throughput and low latency network communication.

Industrial control: applied in industrial automation and control systems for real-time data processing and control.

Medical equipment: Used in medical imaging and data processing devices, providing high-performance computing capabilities.

Military and Defense: Suitable for military and defense applications that require strict environmental and performance standards.

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