Radisys 067-11250-0030計算模塊 是一款計算模塊，通常用于嵌入式和工業(yè)計算應用。

Radisys 067-11250-0030計算模塊 詳情介紹： 

Radisys 067-11250-0030 是一款計算模塊，通常用于嵌入式和工業(yè)計算應用。以下是有關(guān)該計算模塊的一些主要特點和技術(shù)規(guī)格：

主要特點

1. 高性能計算:

• 處理器: 通常配備高性能處理器（如Intel Xeon、Core i系列等），提供強大的計算能力。
• 內(nèi)存: 支持大量內(nèi)存配置，滿足高負載和高性能計算需求。

2. 模塊化設計:

• 可擴展性: 模塊化設計支持多種配置和擴展選項，適用于不同的應用場景。
• 兼容性: 設計用于與各種工業(yè)和嵌入式系統(tǒng)兼容，支持靈活的集成。

3. 接口和擴展:

• 網(wǎng)絡接口: 通常包括多個千兆以太網(wǎng)端口，支持高速網(wǎng)絡連接。
• 存儲接口: 提供多種存儲接口，如SATA、NVMe等，支持高速存儲設備。
• 擴展槽: 支持PCIe等擴展槽，用于添加額外的擴展卡和模塊。

4. 工業(yè)級設計:

• 耐用性: 設計用于工業(yè)環(huán)境，具備抗震動、抗沖擊的能力。
• 散熱: 配備高效散熱系統(tǒng)，確保模塊在高負載下穩(wěn)定運行。

Radisys 067-11250-0030計算模塊 實物圖片：

english introduction:

Radisys 067-11250-0030 is a computing module typically used for embedded and industrial computing applications. The following are some of the main features and technical specifications of the computing module:

main features 

High performance computing:

Processor: Typically equipped with high-performance processors such as Intel Xeon, Core i series, etc., providing powerful computing power.

Memory: Supports a large number of memory configurations to meet high load and high-performance computing needs.

Modular design:

Scalability: Modular design supports multiple configurations and expansion options, suitable for different application scenarios.

Compatibility: Designed to be compatible with various industrial and embedded systems, supporting flexible integration.

Interfaces and extensions:

Network interface: typically includes multiple Gigabit Ethernet ports, supporting high-speed network connections.

Storage interface: Provides multiple storage interfaces, such as SATA, NVMe, etc., supporting high-speed storage devices.

Expansion slot: Supports PCIe and other expansion slots for adding additional expansion cards and modules.

Industrial grade design:

Durability: Designed for industrial environments, it has the ability to resist vibration and impact.

Heat dissipation: Equipped with an efficient heat dissipation system to ensure stable operation of the module under high loads.

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