RADISYS 61-0283-31 CPU電路板 是一款CPU電路板，廣泛應(yīng)用于工業(yè)計(jì)算機(jī)和嵌入式系統(tǒng)中。
RADISYS 61-0283-31 CPU電路板 詳情介紹：
Radisys 61-0283-31 是一款CPU電路板，廣泛應(yīng)用于工業(yè)計(jì)算機(jī)和嵌入式系統(tǒng)中。以下是該CPU電路板的詳細(xì)信息：
主要功能和特點(diǎn)
處理器:
- 處理器類型: 可能支持各種高性能處理器，如Intel的Xeon或Core系列，或AMD的Ryzen系列，具體取決于板子的配置。
- 多核處理: 支持多核處理器，提供強(qiáng)大的計(jì)算能力和多任務(wù)處理能力。
內(nèi)存:
- 內(nèi)存插槽: 配備多個內(nèi)存插槽，通常支持DDR3或DDR4內(nèi)存，允許用戶根據(jù)需要擴(kuò)展內(nèi)存容量。
- 最大內(nèi)存容量: 設(shè)計(jì)上支持大容量內(nèi)存，以滿足高性能計(jì)算需求。
存儲接口:
- SATA 接口: 提供多個SATA接口，用于連接硬盤驅(qū)動器（HDD）或固態(tài)硬盤（SSD），用于數(shù)據(jù)存儲。
- M.2 或 NVMe: 可能支持更高速的存儲選項(xiàng)，如M.2接口或NVMe SSD。
擴(kuò)展插槽:
- PCI/PCIe 插槽: 配備多個PCI或PCIe插槽，支持安裝額外的擴(kuò)展卡，如網(wǎng)絡(luò)接口卡、圖形卡等。
- 模塊化設(shè)計(jì): 支持根據(jù)需求添加或更換擴(kuò)展卡，提高系統(tǒng)的靈活性和功能擴(kuò)展性。
網(wǎng)絡(luò)接口:
- 以太網(wǎng)接口: 通常配備多個以太網(wǎng)接口，如千兆以太網(wǎng)（1G）或萬兆以太網(wǎng)（10G），用于高速網(wǎng)絡(luò)連接和數(shù)據(jù)傳輸。
- 無線選項(xiàng): 可能支持無線網(wǎng)絡(luò)接口，如Wi-Fi或Bluetooth，具體取決于配置。
I/O 接口:
- USB 接口: 提供多個USB接口，用于連接外部設(shè)備，如鼠標(biāo)、鍵盤和外部存儲。
- 串行和并行接口: 支持傳統(tǒng)的串行（COM）和并行（LPT）接口，用于連接各種工業(yè)設(shè)備。
顯示接口:
- 視頻輸出: 配備視頻輸出接口，如VGA、DVI、HDMI或DisplayPort，支持連接顯示器。
- 高分辨率支持: 支持高分辨率顯示，適用于需要高圖像質(zhì)量的應(yīng)用。
電源管理:
- 電源接口: 提供標(biāo)準(zhǔn)電源接口，通常支持工業(yè)級電源輸入。
- 電源保護(hù): 具備電源保護(hù)功能，如過電流保護(hù)和短路保護(hù)，確保穩(wěn)定運(yùn)行。
散熱和冷卻:
- 散熱設(shè)計(jì): 配備散熱片或風(fēng)扇，幫助管理CPU和其他組件的溫度。
- 通風(fēng)設(shè)計(jì): 優(yōu)化的散熱設(shè)計(jì)，確保系統(tǒng)在高負(fù)荷下保持穩(wěn)定運(yùn)行。
工業(yè)認(rèn)證:
- 可靠性: 符合工業(yè)標(biāo)準(zhǔn)，具有高可靠性和耐用性，適用于嚴(yán)苛的工業(yè)環(huán)
RADISYS 61-0283-31 CPU電路板 實(shí)物圖片：
english introduction:
Radisys 61-0283-31 is a CPU circuit board widely used in industrial computers and embedded systems. The following is the detailed information of the CPU circuit board:
Main functions and features
Processor:
Processor type: It may support various high-performance processors, such as Intel's Xeon or Core series, or AMD's Ryzen series, depending on the configuration of the board.
Multi core processing: Supports multi-core processors, providing powerful computing and multitasking capabilities.
Memory:
Memory Slot: Equipped with multiple memory slots, typically supporting DDR3 or DDR4 memory, allowing users to expand memory capacity as needed.
Maximum memory capacity: Designed to support large capacity memory to meet high-performance computing requirements.
Storage interface:
SATA interface: Provides multiple SATA interfaces for connecting hard disk drives (HDD) or solid state drives (SSD) for data storage.
M. 2 or NVMe: may support higher speed storage options such as M.2 interface or NVMe SSD.
Expansion slot:
PCI/PCIe slots: Equipped with multiple PCI or PCIe slots, supporting the installation of additional expansion cards such as network interface cards, graphics cards, etc.
Modular design: supports adding or replacing expansion cards according to requirements, improving the flexibility and functional scalability of the system.
Network interface:
Ethernet interface: Typically equipped with multiple Ethernet interfaces, such as Gigabit Ethernet (1G) or 10 Gigabit Ethernet (10G), used for high-speed network connections and data transmission.
Wireless options: may support wireless network interfaces such as Wi Fi or Bluetooth, depending on the configuration.
I/O interface:
USB interface: Provides multiple USB interfaces for connecting external devices such as mice, keyboards, and external storage.
Serial and parallel interfaces: Supports traditional serial (COM) and parallel (LPT) interfaces for connecting various industrial devices.
Display interface:
Video output: Equipped with video output interfaces such as VGA, DVI, HDMI, or DisplayPort, supporting connection to a monitor.
High resolution support: Supports high-resolution display, suitable for applications that require high image quality.
Power management:
Power interface: Provides standard power interface, usually supporting industrial grade power input.
Power protection: Equipped with power protection functions such as overcurrent protection and short circuit protection to ensure stable operation.
Heat dissipation and cooling:
Heat dissipation design: Equipped with heat sinks or fans to help manage the temperature of the CPU and other components.
Ventilation design: Optimized heat dissipation design ensures stable operation of the system under high loads.
Industrial certification:
Reliability: Compliant with industrial standards, with high reliability and durability, suitable for harsh industrial environments
RADISYS 61-0283-31 CPU電路板 相關(guān)產(chǎn)品：
5SHX1445H0001 Low volta power supply chip
5SHY3545L0010 Programming logic controller
61430001-XG industrial control equipment modul
| PMA24D-00100-00 | AMAT 0100-09292 | PFTL101A 1.0KN |
| PMA21B-10100-00 | AMAT 0100-71261 | PFTL101A 2.0KNK |
| PMA13B-00100-01 | AMAT 0100-02485 | PFTL101A 2.0KNK |
| PMA42Q-11100-00 | AMAT 0100-00897 | PFTL-101A 3BSE008508R1 |
| PMA11A-00100-00 | AMAT 0100-20335 | PFTL101A 1.0KN 3BSE004166R1 |
| PMA43N-00100-00 | AMAT 0100-00534 | PFTL101A-0.5 3BSE004160R1 0.5 |
| PMA43Q-00100-00 | AMAT 0100-00059 | PFTL101A-0.5KN 3BSE004166R1 |
| PMA22B-00100-00 | AMAT 0100-38027 | PFTL101A-1.0KN 3BSE004166R1 1.0KN |
| PMA43J-1050B-08 | AMAT 0100-00035 | PFTL101A-1.0KN 3BSE004166R1 |
