RADISYS 61-0367-38印刷電路板  是一款用于高性能嵌入式系統(tǒng)和工業(yè)自動化的電路板。

RADISYS 61-0367-38印刷電路板  詳情介紹：

RADISYS 61-0367-38 印刷電路板 (PCB) 是一款用于高性能嵌入式系統(tǒng)和工業(yè)自動化的電路板。以下是該印刷電路板的詳細(xì)信息，包括主要特點(diǎn)、技術(shù)規(guī)格和應(yīng)用領(lǐng)域：

主要特點(diǎn)

1. 高性能設(shè)計(jì)

• 高集成度: 集成了多種電子組件，提供穩(wěn)定的信號傳輸和處理能力。
• 高頻支持: 設(shè)計(jì)用于支持高頻信號傳輸，適用于高速數(shù)據(jù)處理應(yīng)用。

2. 可靠性和耐用性

• 工業(yè)標(biāo)準(zhǔn): 設(shè)計(jì)符合工業(yè)標(biāo)準(zhǔn)，適應(yīng)惡劣環(huán)境中的長時間運(yùn)行。
• 耐用材料: 使用高質(zhì)量PCB材料，確保長期穩(wěn)定性和耐用性。

3. 豐富的接口

• 數(shù)據(jù)接口: 提供多個數(shù)據(jù)接口，支持多種外圍設(shè)備的連接。
• 電源接口: 設(shè)計(jì)有電源接口，確保穩(wěn)定的電力供應(yīng)。

4. 高密度布線

• 小型化設(shè)計(jì): 高密度布線設(shè)計(jì)，提高電路板的集成度和功能密度。
• 減少干擾: 優(yōu)化布線以減少電磁干擾，提高信號完整性。

5. 散熱設(shè)計(jì)

• 散熱措施: 采用散熱設(shè)計(jì)和材料，防止過熱對電路板性能的影響。

技術(shù)規(guī)格

1. 尺寸和形狀

• 尺寸: 具體尺寸根據(jù)設(shè)計(jì)要求而異，通常為標(biāo)準(zhǔn)工業(yè)尺寸。
• 形狀: 通常為矩形，設(shè)計(jì)符合嵌入式系統(tǒng)和工業(yè)設(shè)備的安裝需求。

2. 材料

• 基材: 采用高質(zhì)量FR-4或其他工業(yè)標(biāo)準(zhǔn)PCB基材。
• 銅厚度: 根據(jù)設(shè)計(jì)要求，常見為1oz/ft2或2oz/ft2銅厚度。

3. 層數(shù)

• 層數(shù): 通常為多層設(shè)計(jì)，常見的有4層、6層或更多層，以支持復(fù)雜電路設(shè)計(jì)。

4. 接口和連接

• 接口類型: 包含各種接口，如USB、以太網(wǎng)、串口、并行端口等，具體接口類型取決于應(yīng)用需求。
• 電源連接: 支持多種電源連接方式，確保電力供應(yīng)穩(wěn)定。

5. 信號完整性

• 布線技術(shù): 采用高頻布線技術(shù)，以保持信號完整性和減少干擾。

RADISYS 61-0367-38印刷電路板 實(shí)物圖片：

english introduction:

RADASYS 61-0367-38 printed circuit board (PCB) is a circuit board used for high-performance embedded systems and industrial automation. The following is detailed information about the printed circuit board, including its main features, technical specifications, and application areas:

main features 

High performance design

High integration: It integrates multiple electronic components to provide stable signal transmission and processing capabilities.

High frequency support: designed to support high-frequency signal transmission, suitable for high-speed data processing applications.

Reliability and durability

Industrial standards: Designed to meet industrial standards and adapt to long-term operation in harsh environments.

Durable materials: Use high-quality PCB materials to ensure long-term stability and durability.

Rich interfaces

Data interface: Provides multiple data interfaces and supports the connection of various peripheral devices.

Power interface: Designed with a power interface to ensure stable power supply.

High density wiring

Miniaturization design: high-density wiring design to improve the integration and functional density of circuit boards.

Reduce interference: Optimize wiring to reduce electromagnetic interference and improve signal integrity.

Heat dissipation design

Heat dissipation measures: Adopting heat dissipation design and materials to prevent overheating from affecting the performance of the circuit board.

technical specifications

Size and shape

Size: The specific size varies according to design requirements, usually standard industrial size.

Shape: Typically rectangular, designed to meet the installation requirements of embedded systems and industrial equipment.

Material Science

Substrate: High quality FR-4 or other industrial standard PCB substrates are used.

Copper thickness: According to design requirements, the common copper thickness is 1oz/ft 2 or 2oz/ft 2.

Number of layers

Layers: Typically designed as multiple layers, commonly including 4, 6, or more layers, to support complex circuit designs.

Interface and Connection

Interface type: It includes various interfaces such as USB, Ethernet, serial port, parallel port, etc. The specific interface type depends on the application requirements.

Power Connection: Supports multiple power connection methods to ensure stable power supply.

Signal integrity

Wiring technology: Adopting high-frequency wiring technology to maintain signal integrity and reduce interference.

RADISYS 61-0367-38印刷電路板 相關(guān)產(chǎn)品：

 350-017614-132D Controller card

 350-027750-746001P control pulse card

 531X121PCRALG1 Output module

RadiSys 61-0475-14輸入輸出模塊

RADISYS SBC38612單板計(jì)算機(jī)

RadiSys 061-01262-0020軸運(yùn)動控制