RADISYS EXM-MX80擴展內(nèi)存模塊 是一種用于增加系統(tǒng)內(nèi)存容量的擴展模塊，通常用于高性能計算和工業(yè)應(yīng)用的服務(wù)器或計算機系統(tǒng)中。
RADISYS EXM-MX80擴展內(nèi)存模塊 詳情介紹：
Radisys EXM-MX80 擴展內(nèi)存模塊 是一種用于增加系統(tǒng)內(nèi)存容量的擴展模塊，通常用于高性能計算和工業(yè)應(yīng)用的服務(wù)器或計算機系統(tǒng)中。以下是關(guān)于此模塊的一些詳細信息：
主要特點
高容量擴展
- 內(nèi)存容量: 提供額外的內(nèi)存容量，支持系統(tǒng)在需要時能夠處理更多的數(shù)據(jù)和運行更復(fù)雜的應(yīng)用程序。
- 模塊化設(shè)計: 允許用戶根據(jù)需求擴展內(nèi)存，靈活滿足不同的計算需求。
兼容性
- 系統(tǒng)兼容性: 設(shè)計用于與特定的Radisys系統(tǒng)或兼容的服務(wù)器平臺配合使用，確保無縫集成。
- 標準接口: 采用標準的內(nèi)存接口，確保與現(xiàn)有系統(tǒng)的兼容性和穩(wěn)定性。
高性能
- 數(shù)據(jù)傳輸速率: 提供高數(shù)據(jù)傳輸速率，以支持高速計算和數(shù)據(jù)處理需求。
- 低延遲: 優(yōu)化的內(nèi)存設(shè)計，減少數(shù)據(jù)訪問延遲，提高系統(tǒng)的響應(yīng)速度和整體性能。
可靠性和穩(wěn)定性
- 高質(zhì)量材料: 使用高質(zhì)量的內(nèi)存芯片和材料，確保長期的可靠性和穩(wěn)定性。
- 容錯設(shè)計: 包括錯誤檢測和糾正功能（ECC），提高內(nèi)存的可靠性，減少數(shù)據(jù)損壞的風險。
易于安裝和維護
- 模塊化: 設(shè)計為可插拔模塊，簡化安裝和維護過程。
- 用戶指南: 提供詳細的用戶指南和安裝說明，確保用戶能夠正確安裝和配置內(nèi)存模塊。
技術(shù)規(guī)格
容量
- 內(nèi)存容量: 根據(jù)模塊的具體型號和配置，提供不同的內(nèi)存容量選項。
接口
- 內(nèi)存接口: 采用標準的內(nèi)存接口，如DIMM（雙列直插內(nèi)存模塊）或其他兼容接口。
性能
- 數(shù)據(jù)傳輸速率: 提供高數(shù)據(jù)傳輸速率，具體取決于內(nèi)存模塊的設(shè)計和規(guī)格。
- 時序和延遲: 優(yōu)化的時序和延遲，以提升系統(tǒng)的整體性能。
電氣參數(shù)
- 工作電壓: 設(shè)計支持特定的工作電壓范圍，確保與系統(tǒng)的兼容性。
- 功耗: 低功耗設(shè)計，減少對系統(tǒng)電源的負擔。
物理尺寸
- 尺寸和形狀: 設(shè)計符合標準尺寸和形狀，以便與系統(tǒng)主板或插槽兼容。
RADISYS EXM-MX80擴展內(nèi)存模塊實物圖片：
english introduction:
The Radisys EXM-MX80 Extended Memory Module is an expansion module used to increase system memory capacity, typically in servers or computer systems for high-performance computing and industrial applications. Here are some detailed information about this module:
main features
High capacity expansion
Memory capacity: Provides additional memory capacity to support the system in processing more data and running more complex applications when needed.
Modular design: allows users to expand memory according to their needs and flexibly meet different computing requirements.
compatibility
System compatibility: Designed to work with specific Radisys systems or compatible server platforms to ensure seamless integration.
Standard interface: Using standard memory interfaces to ensure compatibility and stability with existing systems.
High performance
Data transmission rate: Provides high data transmission rates to support high-speed computing and data processing needs.
Low latency: Optimized memory design reduces data access latency, improves system response speed and overall performance.
Reliability and stability
High quality materials: Use high-quality memory chips and materials to ensure long-term reliability and stability.
Fault tolerant design: including error detection and correction function (ECC), improving memory reliability and reducing the risk of data corruption.
Easy to install and maintain
Modularization: Designed as a pluggable module to simplify installation and maintenance processes.
User Guide: Provides detailed user guides and installation instructions to ensure that users can correctly install and configure memory modules.
technical specifications
capacity
Memory capacity: Different memory capacity options are provided based on the specific model and configuration of the module.
Interface
Memory interface: Using standard memory interfaces such as DIMM (Dual In Line Memory Module) or other compatible interfaces.
performance
Data transfer rate: Provides high data transfer rates, depending on the design and specifications of the memory module.
Timing and latency: Optimized timing and latency to enhance the overall performance of the system.
Electrical parameters
Working voltage: Designed to support specific working voltage ranges, ensuring compatibility with the system.
Power consumption: Low power design reduces the burden on the system power supply.
Physical dimensions
Size and Shape: Designed to conform to standard sizes and shapes for compatibility with system motherboards or slots.
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